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High-density integrated active phased array t/r component layout method based on electromechanical, electrical and thermal

A high-density, phased array technology, applied to electrical components, specific array feeding systems, circuits, etc., can solve problems such as large temperature gradients, high integration, extrusion damage, etc., to solve extrusion damage and improve safety effect

Active Publication Date: 2021-08-06
XIAN INSTITUE OF SPACE RADIO TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, high-density integrated active phased array T / R components are widely used in the form of hard connection, which has the risk of extrusion damage caused by assembly and thermal stress
And due to the high integration, the heat flux distribution is uneven, and the temperature gradient is large, which affects the long-term stability and reliability of the system
In addition, in order to meet the designed array weighting value, the amplitude of different RF channels needs to be trimmed, so the dynamic range of the feeding amplitude will be lost, which is not conducive to the weighting effect of amplitude weighting and large dynamic range

Method used

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  • High-density integrated active phased array t/r component layout method based on electromechanical, electrical and thermal
  • High-density integrated active phased array t/r component layout method based on electromechanical, electrical and thermal
  • High-density integrated active phased array t/r component layout method based on electromechanical, electrical and thermal

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Experimental program
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Effect test

Embodiment

[0117] Embodiment: Arranging T / R components of the shared transceiver array with reference to the method of the present invention.

[0118] step one:

[0119] The size of the array is M×N (M=20, N=20), the size of the radio frequency channel connected to each T / R component and the antenna unit is P×Q (P=1, Q=4), and the total required T The number of / R components is S×T (S=20, T=5). The maximum gear attenuation of the attenuator of the T / R component is A' max =15.5dB, the attenuation step is ΔA=0.5dB. The received amplitude weighted value dynamic range D R =15.5dB, the dynamic range of the emission amplitude weighted value D T = 0dB. due to D R ≥D T , Amp is the weighted value of the receiving array (such as image 3 shown). The maximum amplitude attenuation of the entire array obtained by optimization is A max = 15.5dB.

[0120] Step two:

[0121] Divide the entire array area corresponding to the amplitude weighted value Amp into amplitude weighted sub-areas Θ co...

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Abstract

The present invention provides a high-density integrated active phased array T / R component arrangement method based on electromechanical, electrical and thermal. The implementation steps include: 1. Dividing the T / R component arrangement area into different areas according to the amplitude weighted value Amplitude weighted sub-areas; 2. Determine the 0 attenuation area, the maximum attenuation area and the swap area, and the T / R components arranged in the 0 attenuation area and the maximum attenuation area respectively, and arrange the T / R components in the corresponding area; 3. Divide the exchange area into small attenuation exchange area, large attenuation exchange area and full exchange area, and arrange the remaining T / R components to be arranged in the above-mentioned In the three areas; 4. Adjust the position of the T / R assembly according to the total thickness of each row of T / R assemblies along the extrusion direction, so that the total thickness of each row is consistent. The invention can improve the reliability of the phased array system, improve the heat flux density distribution, and improve the dynamic range of the amplitude distribution.

Description

technical field [0001] The invention belongs to the technical field of antennas, can be used for the arrangement of high-density integrated active phased array T / R components, relates to a method for arranging phased array T / R components, and specifically relates to a high-density integration based on mechanics, electricity and heat Active phased array T / R component arrangement method. Background technique [0002] With the development of microwave technology and the continuous improvement of demand, the scale of active phased array array is getting larger and higher, and the integration degree is getting higher and higher. At present, high-density integrated active phased array T / R components are widely used in the form of hard connection, which has the risk of extrusion damage caused by assembly and thermal stress. Moreover, due to the high degree of integration, the uneven distribution of heat flux and large temperature gradient affect the long-term stability and reliabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/50H01Q21/00H01Q23/00
CPCH01Q1/50H01Q21/0025H01Q23/00
Inventor 杨京杨慧杰范乃康吕鹏张建波李岩张凯黄超马俊
Owner XIAN INSTITUE OF SPACE RADIO TECH
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