Manufacturing method of rigid-flex board with flexible board area overlapping design
A soft-rigid combination board and production method technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problem of destroying the area of the lower layer of the flexible board, and achieve the effect of saving installation space
Inactive Publication Date: 2020-04-14
SHANGHAI FAST PCB CIRCUIT TECH CORP LTD
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Problems solved by technology
This overlapping area needs to be separated, but the shape milling in conventional production is a penetrating design, and conventional milling in the overlapping area will penetrate the entire area, thus destroying the lower soft board area
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[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0021] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. Similarly generalized, the present invention is therefore not limited by the specific embodiments disclosed below.
[0022] Secondly, the present invention is described in detail in conjunction with schematic diagrams. When describing the implementation of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged accor...
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The invention belongs to the technical field of rigid-flex boards, and particularly relates to a manufacturing method of a rigid-flex board with a flexible board area overlapping design. The manufacturing method comprises the following steps of 1, manufacturing a flexible board area connected with a sub-rigid board area; 2, milling the flexible board area of an overlapping design area in advance;3, bonding and laminating flexible board patterns by using non-flowing prepregs, and windowing and exposing the non-flowing prepregs in the exposed flexible board area; 4, during lamination, protecting the area where a whole flexible board is located so as to guarantee that the flexible board area is not directly exposed outside; 5, drilling, and carrying out electroless plating copper and electroplating, outer-layer pattern manufacturing, solder mask manufacturing, surface treatment, electrical measurement and appearance after lamination; and 6, removing a protective layer on a surface of theflexible board area, and exposing the flexible board area to obtain the required rigid-flex board. The rigid-flex board prepared through the steps can be freely assembled and configured, and comparedwith a traditional rigid-flex board, the rigid-flex board greatly saves an installation space.
Description
technical field [0001] The invention relates to the technical field of making rigid-flex boards, in particular to a method for making rigid-flex boards with overlapping design of soft board areas. Background technique [0002] The rigid-flex board is a printed circuit board that connects different hard board parts into a whole through a soft board, and has complete electrical performance. Generally, the soft board area of a soft-hard board is designed to connect different hard board areas, and the soft board area is a whole in appearance. However, there are some soft and hard boards. In order to save space and facilitate device installation, some soft board areas are designed to overlap, so that different hard board areas are completely separated in assembly. Due to the overlapping design of the flexible board area, the intersecting edge area on the flexible board area just crosses and overlaps with another part of the soft board area. This overlapping area needs to be s...
Claims
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IPC IPC(8): H05K3/36H05K3/46
CPCH05K3/361H05K3/4691
Inventor 黄开锋其他发明人请求不公开姓名
Owner SHANGHAI FAST PCB CIRCUIT TECH CORP LTD