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Backboard, backlight module and display device

A technology for backlight modules and backplanes, which is applied to identification devices, optics, nonlinear optics, etc., and can solve problems such as light leakage, deterioration of backplane strength, and peeling.

Active Publication Date: 2020-04-17
XIAMEN TIANMA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the setting of the connection holes, the strength of the back plate is deteriorated, which easily leads to deformation in the area close to the boss part, resulting in the dislocation of the boss part, and then causing problems such as peeling and light leakage.

Method used

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  • Backboard, backlight module and display device
  • Backboard, backlight module and display device
  • Backboard, backlight module and display device

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Embodiment Construction

[0042] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0043] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0045] It should be understood that the term "an...

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Abstract

The invention relates to the technical field of display and particularly relates to a back plate, a backlight module and a display device. The back plate comprises a body part, a bent part and a bosspart, the boss part is arranged on the body part in a protruding mode and connected with a first end of the body part through the bent part, the boss part comprises a first bottom surface, a first side surface, a first connecting part and a first connecting hole, and the body part comprises a second bottom surface, a second side surface, a second connecting part and a second connecting hole. The backboard is advantaged in that the first connecting hole is formed in a first side surface and / or a first bottom surface, the second connecting hole is formed in the second side surface and / or the second bottom surface, the strength of the body part, the boss part and the bent part is improved, so the strength of the back plate is improved, the back plate is effectively prevented from deforming, problems of stripping, light leakage and the like of the display device are avoided, the structural stability of the backlight module and the display device is effectively improved, and the service life of the display device is prolonged.

Description

【Technical field】 [0001] The invention relates to the field of display technology, in particular to a backplane, a backlight module and a display device. 【Background technique】 [0002] Flip-chip LEDs have gradually gained widespread attention in the display industry because they can be integrated and mass-produced, the preparation process is simple, and their performance is excellent. [0003] The flip-chip LED includes a plastic frame and a backplane. In order to ensure that the backlight in the flip-chip LED is flush with the light guide plate, so that all the light emitted by the backlight enters the light guide plate, the position corresponding to the backplane and the backlight Bosses are required. In the prior art, connection holes are provided on the backplane. When the plastic frame is injected, the injection material flows into the connection hole and solidifies, so that the backplane and the plastic frame are connected. Usually, the connection holes are provided ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13357G09F9/30
CPCG02F1/133608G02F1/1336G09F9/30
Inventor 马雄斌
Owner XIAMEN TIANMA MICRO ELECTRONICS