Multipurpose silicon carbide wafer transmission manipulator

Abstract

The invention discloses a multipurpose silicon carbide wafer transmission manipulator. The manipulator comprises a lining plate, a main transmission gear, an auxiliary transmission gear, a main rear auxiliary arm, an auxiliary rear auxiliary arm, a power input module, a main grabbing arm, an auxiliary grabbing arm, a main upper front auxiliary arm, a main lower front auxiliary arm and diameter adjusting modules, wherein the power input module provides power input for the main transmission gear to drive the main transmission gear to rotate; the main grabbing arm is hinged with the main transmission gear and the main rear auxiliary arm; one end of the main upper front auxiliary arm and one end of the main lower front auxiliary arm are hinged to an upper surface and a lower surface of the lining plate respectively, and the other ends are hinged to an upper end and a lower end of a middle portion of the main grabbing arm respectively; one ends of the auxiliary upper front auxiliary arm andthe auxiliary lower front auxiliary arm are hinged to the upper surface and the lower surface of the lining plate, and the other ends are hinged to the upper end and the lower end of the middle portion of the auxiliary grabbing arm; the diameter adjusting modules are installed at tail ends of the main grabbing arm and the auxiliary grabbing arm. Two-stage grabbing can be achieved, and efficientcoordination operation among different cavities in a limited space is achieved.

Description

technical field [0001] The invention relates to the technical field of industrial robots, in particular to a multi-purpose silicon carbide wafer transfer manipulator. Background technique [0002] In recent years, with the vigorous development of information industry and science and technology, new requirements and standards have been put forward for the processing and manufacturing of silicon carbide, especially in the field of IC, stability / reliability / cleanliness / automation / precision and other requirements Has become a development trend. In order to adapt to this trend, both at home and abroad are paying more attention to the field. At present, corresponding research institutions at home and abroad have developed various transmission robots. [0003] The safe access and transportation of silicon carbide wafer processing is a very important technical indicator of the semiconductor production line; in the production process, it is usually required that the grasping failure...

AI Technical Summary

Problems solved by technology

When the manipulator picks and places the wafer, due to the influence of factors such as environmental temperature changes, load changes, and mechanical structure deformation, the manipulator picks and places the wafer on the support mechanism according to the position coordinates stored offline, resulting in collisions. Risk of overcatch or damage to equipment, resulting in irreparable losses

At the same time, due to the thermal deformation of the wafer during the heat treatment process, the actual distribution state of the wafer will be different from the offline teaching position parameters, making the movement of the manipulator in an unsafe state

In addition, at present, different types of manipulators are placed in each process link for single-functional grabbing, and fully automatic (partially automatic) integration involving wafers from ingots / shaping / cutting / grinding / etching / polishing / cleaning A single type of manipulator cannot satisfy multiple types of grasping in a small space during chemical processing

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