A temperature compensator for modal test structure in vacuum environment

A technology of temperature compensator and modal test, which is applied to the simulation device of space navigation conditions, space navigation equipment, transportation and packaging, etc., and can solve the problems of heat loss and other problems of test pieces

Active Publication Date: 2021-04-20
INST OF MECHANICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The high-temperature test piece in the vacuum environment is easy to radiate heat to the surrounding space, causing heat loss inside the test piece

Method used

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  • A temperature compensator for modal test structure in vacuum environment
  • A temperature compensator for modal test structure in vacuum environment

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Embodiment Construction

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] In order to facilitate the understanding of the embodiments of the present invention, further explanations will be given below with specific embodiments in conjunction with the accompanying drawings, which are not intended to limit the embodiments of the present invention.

[0017] see Figure 1-2 , a temperature compensator for modal...

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Abstract

The embodiment of the present invention relates to a temperature compensator for a modal test structure in a vacuum environment, comprising: a thermal vacuum test chamber body, an upper compensation plate and a lower compensation plate, etc. The test piece is fixed on the inner rear wall of the thermal vacuum test chamber body. The upper compensation plate and the lower compensation plate are respectively located on the upper and lower sides of the test piece. The material and thermal load of the upper compensation plate and the lower compensation plate are the same as those of the test piece. The lower compensation plate covers most of the circumferential position of the test piece, which can effectively reduce the heat radiation of the test piece to the surrounding space; the ring base is used to fix the upper compensation plate and the lower compensation plate behind the body of the thermal vacuum test chamber. On the wall, the threaded hole is used to cooperate with the screw. The ring base is fixed on the inner rear wall of the thermal vacuum test chamber body by using the screw. This connection method makes the connection between the upper compensation plate and the lower compensation plate stable and avoids the influence of external force. While vibrating, avoid affecting the test piece.

Description

technical field [0001] The embodiment of the present invention relates to a temperature compensator for a thermal vacuum test, in particular to a temperature compensator for a modal test structure in a vacuum environment. Background technique [0002] The thermal vacuum test refers to the test to verify the performance and function of the test piece under the condition of vacuum and certain temperature. During the development process of the spacecraft, the thermal vacuum test must be carried out. The launched spacecraft, whether it is the first launch or a repeated launch, must undergo an acceptance-level thermal vacuum test for each launch. [0003] The high-temperature test piece in the vacuum environment is easy to radiate heat to the surrounding space, causing heat loss inside the test piece. Contents of the invention [0004] In view of this, in order to reduce the influence of heat radiation, an embodiment of the present invention provides a temperature compensator ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B64G7/00
CPCB64G7/00B64G2007/005
Inventor 郑冠男黄杰杨国伟聂雪媛黄程德宋鑫徐铭杰陈军屹
Owner INST OF MECHANICS CHINESE ACAD OF SCI
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