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Semiconductor manufacturing equipment

A technology for manufacturing equipment and semiconductors. It is used in semiconductor/solid-state device manufacturing, conveyor objects, electrical components, etc. It can solve problems such as inability to disassemble separately, time-consuming and labor-intensive, and difficult and thorough cleaning of windows, so as to improve equipment maintenance efficiency, clear effect

Pending Publication Date: 2020-04-28
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Every time for cleaning and maintenance, due to the operation limitation of the space, it is difficult to clean the inside of the window thoroughly. Usually, it needs to be disassembled to clean thoroughly, which is time-consuming and labor-intensive. Moreover, the window and the first cavity

Method used

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  • Semiconductor manufacturing equipment
  • Semiconductor manufacturing equipment
  • Semiconductor manufacturing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] Such as Figure 1 ~ Figure 3 As shown, this embodiment provides a semiconductor manufacturing device, including: a first cavity 101 , a first transfer window 103 , a second cavity 102 , a second transfer window 104 , a liner 105 , and an yttrium oxide layer 106 .

[0070] The first cavity 101 has a first side wall 109, the second cavity 102 has a second side wall 108, and the second side wall 108 of the second cavity 102 is connected to the first cavity 101 The first side wall 109 of the first cavity 103 is formed on the first side wall 109 of the first cavity 101, and the second transmission window 104 is formed on the first side wall 109 of the second cavity 102. Two side walls 108 , the second transmission window 104 communicates with the first transmission window 103 correspondingly.

[0071] As an example, the length of the first transmission window 103 is between 390-450 mm, and the height is between 170-200 mm, and the four corners of the first transmission window...

Embodiment 2

[0081] Such as Figure 2 ~ Figure 4 As shown, the difference between this embodiment and Embodiment 1 is only that: the first cavity 110 has a first side wall 117, and the second cavity 111 and the third cavity 112 have a second side wall 118, so The first side wall 117 of the first cavity 110 is connected to the second side wall 118 of the second cavity 111 and the third cavity 112, and the first transmission window 123 is formed on the first side wall 117 On one side of the first side wall 117, the third transmission window 125 is formed on the other side of the first side wall 117, the second transmission window 124 is formed on the second side wall 118 of the second cavity 111, and the fourth The transmission window 126 is formed on the second side wall 118 of the third cavity 112, the second transmission window 124 communicates with the first transmission window 123 correspondingly, and the fourth transmission window 126 communicates with the third transmission window 126...

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Abstract

The invention provides semiconductor manufacturing equipment. The semiconductor manufacturing equipment comprises a first cavity, a first conveying window, a second cavity, a second conveying window,a lining and a yttrium oxide layer; the first conveying window is formed in the first side wall of the first cavity; the second side wall of the second cavity is connected to the first side wall of the first cavity; the second conveying window is formed in the second side wall of the second cavity; the second conveying window is correspondingly communicated with the first conveying window; the lining covers the inner wall of the first conveying window; the lining is detachably connected with the first conveying window; and the yttrium oxide layer is formed on the inner surface of the lining. The lining of the semiconductor manufacturing equipment can be detached independently, therefore, the maintenance efficiency of the equipment is improved, and polymers can be removed more thoroughly.

Description

technical field [0001] The invention belongs to the field of semiconductors, in particular to a semiconductor manufacturing equipment. Background technique [0002] In the existing semiconductor manufacturing equipment with two cavities, there is a window between the two cavities. The robot will transfer the wafer from the first chamber to the second chamber. Due to the pressure difference and gas escape, the polymer produced in the second chamber will enter the window and adhere to the window surface. [0003] Every time for cleaning and maintenance, due to the operation limitation of the space, it is difficult to clean the inside of the window thoroughly. Usually, it needs to be disassembled to clean thoroughly, which is time-consuming and labor-intensive. Moreover, the window and the first cavity are integrally formed and cannot be disassembled separately. Therefore, this The purpose of the invention is to provide a semiconductor manufacturing equipment whose inner liner...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67155H01L21/67706
Inventor 吴潇
Owner CHANGXIN MEMORY TECH INC