Semiconductor package and method of manufacturing same

A semiconductor, mounting surface technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc.

Pending Publication Date: 2020-04-28
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] According to embodiments of the present disclosure, semiconductor packages and methods of manufacturing semiconductor packages are provided to solve or partially solve the above-mentioned problems and other problems existing in existing semiconductor packages

Method used

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  • Semiconductor package and method of manufacturing same
  • Semiconductor package and method of manufacturing same
  • Semiconductor package and method of manufacturing same

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Embodiment Construction

[0028] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for exemplary purposes only, and are not intended to limit the protection scope of the present disclosure.

[0029] As mentioned above, there is currently a need to improve the anti-interference performance of semiconductor devices. In view of the above problems and other possible potential problems, embodiments of the present disclosure provide a semiconductor package and a method for manufacturing the semiconductor package. The following combination Figure 1-...

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PUM

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Abstract

The embodiment of the invention relates to a semiconductor package. The semiconductor package includes: a substrate including a plurality of connection pads and a plurality of ground pads; an electronic component coupled to the mounting surface of the substrate and connected with at least one of the plurality of connection pads through at least one lead; a first dielectric layer disposed on a first surface away from the substrate of the electronic component and including an insulating surface and a ground surface disposed opposite to each other; the insulating surface is insulatively coupled to the first surface of the electronic component; and the ground surface is connected with the plurality of ground pads via the first shielding structure. The semiconductor package with a shielding structure is provided. The embodiment of the invention further provides a manufacturing method of the semiconductor package.

Description

technical field [0001] Embodiments of the present disclosure relate generally to the field of semiconductors, and more particularly, to semiconductor packages and methods of manufacturing semiconductor packages. Background technique [0002] Integrated circuits and other electronic devices may be packaged on semiconductor packages. Semiconductor packages can be integrated into products such as wireless communication devices or other products. In some cases, integrated circuits and / or electronic devices on semiconductor packages may interfere with each other or with other electronic components. [0003] It is necessary to provide a semiconductor package structure to improve the anti-interference capability of the semiconductor package. Contents of the invention [0004] According to embodiments of the present disclosure, a semiconductor package and a method of manufacturing a semiconductor package are provided to solve or partially solve the above-mentioned problems and o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L21/56H01L23/31H01L23/552
CPCH01L25/16H01L23/552H01L23/3121H01L21/56H01L2224/48091H01L2924/00014
Inventor 范立云王德信陶源
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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