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Silicone adhesive composition and adhesive tape

A silicone and adhesive technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc. and other problems, to achieve the effect of high adhesion

Active Publication Date: 2022-02-01
TERAOKA SEISAKUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, sometimes, during high-temperature processes such as lamination and reflow of components, such as figure 2 As shown in (C), the adhesive tape 14 cannot suppress the rebound of the FPC 15 and peels off from the conveying body 13
In addition, there is a concern that the cohesive force inside the adhesive will be weaker than the adhesive force at the interface between the adhesive and the adherend, and peeling will occur while cohesive failure inside the adhesive occurs.
On the other hand, in Patent Documents 1 and 2, there is no mention of adhesiveness in a high-temperature environment
Patent Document 3 is intended to suppress the increase in adhesive force after use in a high-temperature environment and to enable easy peeling, so it is considered unsuitable for applications such as bonding members by suppressing strong rebound in a high-temperature environment

Method used

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  • Silicone adhesive composition and adhesive tape
  • Silicone adhesive composition and adhesive tape
  • Silicone adhesive composition and adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] In Example 1, the peroxide-curable silicone-based adhesive stock solution (I) was selected in which the tanδ peak temperature, the storage modulus at 300°C, and the tanδ at 300°C were specific values ​​described later among the plurality of trial products. .

[0057] Then, 100 parts of the peroxide-curable silicone adhesive stock solution (I) with a solid content concentration of 50% by mass, 67 parts of toluene as a diluting solvent, 5.0 parts of NOF Co., Ltd. Organic peroxide type curing agent (NYPER (registered trademark) BMT-K40, concentration of organic peroxide: 40%, theoretical active oxygen content in organic peroxide: 6.05%) were uniformly mixed to obtain adhesive liquid (1 ). In this adhesive liquid (1), the product PA of the amount P of the organic peroxide and the theoretical active oxygen amount A of the organic peroxide was 0.242 parts.

[0058] The adhesive liquid (1) was subjected to the dynamic viscoelasticity measurement described below. As a result,...

Embodiment 2

[0066] Except having changed the quantity of the organic peroxide into 3.75 parts, the adhesive agent liquid (2) was prepared by the method similar to Example 1, and the adhesive tape was produced. In the adhesive liquid (2), the product PA of the amount P of the organic peroxide and the theoretical active oxygen amount A of the organic peroxide was 0.182 parts. The dynamic viscoelasticity measurement of the adhesive liquid (2) revealed that the peak temperature of tanδ was 29°C, the storage modulus G' at 300°C was 41968 Pa, and the tanδ at 300°C was 0.11.

Embodiment 3

[0068] Except having changed the quantity of the organic peroxide into 3 parts, the adhesive agent liquid (3) was prepared by the method similar to Example 1, and the adhesive tape was produced. In the adhesive liquid (3), the product PA of the amount P of the organic peroxide and the theoretical active oxygen amount A of the organic peroxide was 0.157 parts. The dynamic viscoelasticity measurement of the adhesive liquid (3) revealed that the peak temperature of tanδ was 24°C, the storage modulus G' at 300°C was 32229 Pa, and the tanδ at 300°C was 0.16.

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Abstract

Disclosed is a silicone-based adhesive composition, which contains a silicone structure cured by organic peroxides. The dynamic viscoelasticity measurement after curing (temperature range -60°C to 300°C, heating rate 10°C / min , frequency 10Hz), (1) the storage modulus G' at 300°C is more than 12000Pa, (2) the tanδ at 300°C is at least 0.04 and less than 0.21, and (3) it exists in the temperature range of -60°C to 150°C The peak temperature of tan δ in the invention is 6°C to 60°C; and an adhesive tape (2) having an adhesive layer composed of the silicone-based adhesive composition that can be used well in a high-temperature environment is disclosed.

Description

technical field [0001] The present invention relates to an organic adhesive tape that has high adhesiveness to members when used in a high-temperature environment and can be peeled off without leaving adhesive residue after use in a high-temperature environment, for example, in an adhesive tape used in the manufacturing process of electronic components and semiconductor components. Silicone adhesive composition and adhesive tape. Background technique [0002] The silicone-based adhesive composition is excellent in heat resistance, cold resistance, weather resistance, electrical insulation, and chemical resistance. Furthermore, particularly adhesive tapes having a silicone-based adhesive layer are less likely to leave adhesive residue when peeled off even when used in a high-temperature environment. Therefore, such adhesive tapes are widely used for protection, shielding, temporary fixation, fixation during transportation, splicing, and the like of components and components ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J11/06
CPCC09J11/06C09J183/04C09J7/30C09J7/22C09J2301/312
Inventor 土屋靖史石川和树岩本太郎
Owner TERAOKA SEISAKUSHO