Showerhead and substrate processing apparatus

Abstract

According to one embodiment of the present invention, a substrate processing apparatus comprises: a chamber in which a process for a substrate is performed; a showerhead provided inside the chamber soas to spray a reaction gas toward the substrate; and a susceptor provided below the showerhead and supporting the substrate, wherein the showerhead includes: a showerhead body having an inner space,to which a reaction gas is supplied from the outside, and a plurality of spray holes communicating with the inner space so as to spray the reaction gas therein; an inflow plate provided in the inner space so as to be capable of partitioning the inner space into an inflow space and a buffer space, and having a plurality of inflow ports communicating with the inflow space and the buffer space; and aplurality of adjusting plates, which are provided in the inflow ports and can move, and can restrict the movement of the reaction gas from the inflow space to the buffer space according to the distance from the inflow plate in accordance with the movement of the adjusting plates.

Description

technical field [0001] The present invention relates to a shower head and a substrate processing device, and more particularly relates to a shower head and a substrate processing device capable of moving a plurality of regulating plates to limit the movement of reaction gas. Background technique [0002] A semiconductor device includes many layers on a silicon substrate, and these layers are vapor-deposited on the substrate through a vapor deposition process. There are several important issues with this evaporation process that are important for evaluating the deposited film and selecting the evaporation method. [0003] First, is the "quality" of the deposited film. This means composition, contamination levels, defect density, and mechanical and electrical properties. The composition of the film can change according to the vapor deposition conditions, which is very important for obtaining a specific composition. [0004] Second, is uniform thickness throughout the wafer....

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Problems solved by technology

[0006] Among these issues, uniformity is one of the important issues related to the evaporation process. An uneven film causes high electrical resistance (electrical resistance) on the metal wiring, increasing the possibility of mechanical damage

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