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Preparation process method of white-light LED and white-light LED

A preparation process and technology of LED chips, which are applied in the preparation of white light LEDs and in the field of white light LEDs, can solve the problems such as the decline of light effect and light quality.

Active Publication Date: 2020-05-08
EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problems existing in the prior art, the embodiment of the present invention provides a white light LED preparation method and a white light LED, which are used to solve the problem of light efficiency caused by the high temperature of the phosphor layer of the remote phosphor powder type high-power white light LED in the prior art. Technical issues with reduced light quality

Method used

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  • Preparation process method of white-light LED and white-light LED
  • Preparation process method of white-light LED and white-light LED
  • Preparation process method of white-light LED and white-light LED

Examples

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Embodiment 1

[0040] This embodiment provides a method for preparing a white light LED. The power of the white light LED is greater than 1W, such as figure 1 As shown, the methods include:

[0041] S110, preparing a white light conversion plate;

[0042] Here, the white light conversion plate includes: YAG: Ce 3+ A yellow phosphor layer, an aluminum nitride AlN film and a sapphire substrate, the AlN film is deposited on the sapphire substrate, and the AlN film is covered with the phosphor layer. In order to improve the heat dissipation effect of the phosphor layer, the thermal conductivity of the sapphire substrate is 35W / (m·K).

[0043] Then the specific implementation of preparing the white light conversion plate is as follows:

[0044] A double-sided polished sapphire substrate is selected as the substrate of the yellow phosphor layer and the AlN film, and the thickness of the sapphire substrate is 300-400 μm;

[0045] Using an organic reagent to deeply clean the upper and lower surf...

Embodiment 2

[0066] This embodiment provides a white light LED, such as figure 2 As shown, the white light LED includes: a white light conversion board 1 and a metal dam support 2 ; the white light conversion board 1 and the metal dam support 2 are packaged together by a sealant 3 .

[0067] The white light conversion board is packaged together with the metal dam bracket through a sealant, and the white light conversion board is placed above the metal dam bracket;

[0068] An LED chip array 4 is fixed in the metal dam support;

[0069] The white light conversion plate includes: YAG: Ce 3+ Yellow phosphor layer, aluminum nitride AlN film and sapphire substrate; wherein, see image 3 , the AlN film is deposited on the sapphire substrate, the AlN film is covered with the phosphor layer, the AlN film is crystal-bonded with the sapphire substrate, and the heat of the AlN film after bonding is The conductivity is 300W / (m·K). The thickness of the sapphire substrate is 300-400 μm. The therma...

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Abstract

The invention provides a white light LED preparation process method and a white light LED, and the method comprises: preparing a white light conversion plate which comprises a YAG:Ce<3+> yellow fluorescent powder layer, an AlN film and a sapphire substrate, depositing the AlN film on the sapphire substrate, and enabling the AlN film to be covered with the fluorescent powder layer; fixing the LED chip array in a cleaned metal box dam support; dispensing a sealant on the metal box dam bracket by using a dispensing machine; and placing the white light conversion plate on a metal box dam support and then baking for 1-1.5 h at the temperature of 150-160 DEG C, wherein the thermal conductivity of the AlN film is 300W / (m.K). The AlN film can provide an efficient heat conduction channel, and hugeheat generated by the fluorescent powder particles excited by the LED chip can be quickly led out to the radiator and the external environment through the efficient heat conduction channel, so that the working temperature of the fluorescent powder is reduced, and the lighting effect and the illumination quality of the high-power white light LED are improved.

Description

technical field [0001] The invention relates to the technical field of LED preparation, in particular to a preparation process method of a white light LED and the white light LED. Background technique [0002] The traditional incandescent and fluorescent lighting industry has undergone revolutionary changes, more energy-saving, longer life, and more environmentally friendly solid-state lighting sources (white LEDs) have been widely used to cope with the increasingly severe energy crisis and global climate Variety. [0003] At present, in the remote phosphor type high-power white LED, the phosphor layer will accumulate and generate huge heat due to Stokes shift loss and light absorption. The high temperature of the phosphor layer will cause the phonons of the excited electrons to relax, and produce a "thermal quenching" phenomenon that reduces the luminous intensity by an order of magnitude, accompanied by color coordinate shifts, wavelength shifts, and uneven illumination. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/58
CPCH01L33/48H01L33/502H01L33/58
Inventor 郑志华梁仁瓅张毅王昊戴江南陈长清
Owner EZHOU INST OF IND TECH HUAZHONG UNIV OF SCI & TECH