Preparation process method of white-light LED and white-light LED
A preparation process and technology of LED chips, which are applied in the preparation of white light LEDs and in the field of white light LEDs, can solve the problems such as the decline of light effect and light quality.
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Embodiment 1
[0040] This embodiment provides a method for preparing a white light LED. The power of the white light LED is greater than 1W, such as figure 1 As shown, the methods include:
[0041] S110, preparing a white light conversion plate;
[0042] Here, the white light conversion plate includes: YAG: Ce 3+ A yellow phosphor layer, an aluminum nitride AlN film and a sapphire substrate, the AlN film is deposited on the sapphire substrate, and the AlN film is covered with the phosphor layer. In order to improve the heat dissipation effect of the phosphor layer, the thermal conductivity of the sapphire substrate is 35W / (m·K).
[0043] Then the specific implementation of preparing the white light conversion plate is as follows:
[0044] A double-sided polished sapphire substrate is selected as the substrate of the yellow phosphor layer and the AlN film, and the thickness of the sapphire substrate is 300-400 μm;
[0045] Using an organic reagent to deeply clean the upper and lower surf...
Embodiment 2
[0066] This embodiment provides a white light LED, such as figure 2 As shown, the white light LED includes: a white light conversion board 1 and a metal dam support 2 ; the white light conversion board 1 and the metal dam support 2 are packaged together by a sealant 3 .
[0067] The white light conversion board is packaged together with the metal dam bracket through a sealant, and the white light conversion board is placed above the metal dam bracket;
[0068] An LED chip array 4 is fixed in the metal dam support;
[0069] The white light conversion plate includes: YAG: Ce 3+ Yellow phosphor layer, aluminum nitride AlN film and sapphire substrate; wherein, see image 3 , the AlN film is deposited on the sapphire substrate, the AlN film is covered with the phosphor layer, the AlN film is crystal-bonded with the sapphire substrate, and the heat of the AlN film after bonding is The conductivity is 300W / (m·K). The thickness of the sapphire substrate is 300-400 μm. The therma...
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Abstract
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