Three-dimensional board compounding method

Abstract

The invention discloses a three-dimensional board compounding method which comprises the following steps: (1) conveying an embossed three-dimensional core board along a feeding direction, and simultaneously carrying out roller surface contact gluing on an upper convex pattern on the upper surface of the three-dimensional core board and a lower convex pattern on the lower surface of the three-dimensional core board to form glue film layers on the upper convex pattern and the lower convex pattern respectively; and (2) simultaneously and respectively rolling an upper pressing plate and a lower pressing plate on the upper surface and the lower surface of the glued three-dimensional core board to form the composite three-dimensional board. According to the three-dimensional board compounding method disclosed by the invention, the glue film layers are respectively formed at the upper convex pattern on the upper surface of the three-dimensional core board and the lower convex pattern on the lower surface of the three-dimensional core board, so that the consumption of glue and the energy consumption of subsequent drying and compounding of the three-dimensional board are effectively reduced.

Description

technical field [0001] The invention relates to a three-dimensional plate composite method. Background technique [0002] In the existing technology, when compounding three-dimensional boards, glue is generally applied on the lower surface of the upper platen and the upper surface of the lower platen, and then the upper platen and the lower platen are rolled and compounded on the three-dimensional core plate at the same time. Since the upper surface and the lower surface of the three-dimensional core board have an upper convex pattern and a lower convex pattern respectively, this glue application method not only causes waste of glue at the place where the lower surface of the upper platen is not in contact with the upper convex pattern, but also causes no glue on the upper surface of the lower platen. The glue in contact with the lower convex pattern causes waste; it also leads to an increase in energy consumption for subsequent drying of the composite three-dimensional boar...

AI Technical Summary

Problems solved by technology

Since the upper surface and the lower surface of the three-dimensional core board have an upper convex pattern and a lower convex pattern respectively, this glue application method not only causes waste of glue at the place where the lower surface of the upper platen is not in contact with the upper convex pattern, but also causes no glue on the upper surface of the lower platen. The glue in contact with the lower convex pattern causes waste; it also leads to increased energy consumption for subsequent drying of the composite three-dimensional board

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