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Transformer modules and power modules

A transformer module and copper foil technology, applied in the field of transformers, can solve the problems of uneven distribution of winding current, aggravate pin loss, pin loss, etc., achieve convenient and flexible winding formation, avoid winding inconvenience, and have similar equivalent impedances. Effect

Active Publication Date: 2021-12-07
DELTA ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, all the current on the winding flows through this pin, which not only makes the winding current distribution uneven, but also causes a huge loss on this pin
In addition, in the existing transformer structure, the pin is usually relatively long, which further aggravates the loss on the pin

Method used

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  • Transformer modules and power modules
  • Transformer modules and power modules
  • Transformer modules and power modules

Examples

Experimental program
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Effect test

Embodiment Construction

[0134] For transformers used in low-voltage and high-current applications, in the prior art, most of the windings adopt a vertical winding structure realized by a multi-layer PCB. At this time, the plane of the PCB board is perpendicular to the magnetic column, and the winding around the magnetic column is formed by wiring on the PCB wiring layer. . However, the structure of the vertical winding will lead to the inconsistency of the inner and outer equivalent diameters of the metal winding traces, resulting in the equivalent impedance of the inner winding being smaller than the equivalent impedance of the outer winding, resulting in uneven distribution of winding current, resulting in greater winding loss.

[0135] In addition, another structure in the prior art adopts a foil-wound structure, in which the winding outlet is usually drawn from the side of the winding, so the current distribution of the winding near the outlet is not uniform, especially when This problem is exace...

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PUM

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Abstract

The present application provides a transformer module and a power module, the transformer module includes a magnetic core, including at least one magnetic column, the magnetic column is at least partially covered by a multilayer carrier board, the multilayer carrier board includes a plurality of horizontal copper foils and A plurality of connection copper foils; horizontal copper foils are located on the horizontal wiring layer, and the connection copper foils are used to connect horizontal copper foils; a first winding and a second winding around the magnetic column, the second winding is located outside the first winding; the first winding and the second winding are formed by horizontal copper foil and connecting copper foil; the first end of the first winding is electrically connected to the first surface mount pin; the second end of the first winding is electrically connected to the second surface mount pin Sexual connection; the first end of the second winding is electrically connected to the third surface-mount pin; the second end of the second winding is electrically connected to the fourth surface-mount pin; the above-mentioned surface-mount pins are set at Surface of the transformer module. The current distribution of the windings included in the transformer module and the power module of the present application is even when in use.

Description

technical field [0001] The present application relates to the technical field of transformers, in particular to a transformer module and a power module. Background technique [0002] With the improvement of human's requirements for intelligent life, the society's demand for data processing is increasingly strong. The global energy consumption in data processing reaches hundreds of billions or even trillions of kWh per year on average; and the floor area of ​​a large data center can reach tens of thousands of square meters. Therefore, high efficiency and high power density are key indicators for the healthy development of this industry. [0003] The key unit of the data center is the server, and its motherboard is usually composed of data processing chips such as a central processing unit (Central Processing Unit, CPU), chipset (Chipsets), memory, etc., their power supply and necessary peripheral components. With the improvement of server processing capacity per unit volume...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/28H01F27/29H01F27/32
CPCH01F27/2804H01F27/292H01F27/323H01F27/2895H01F27/29H01F27/303H01F27/306H01F2027/2809H01F2027/2814H01F27/027H01F27/2847H01F27/32H01F41/0233
Inventor 蔡超峰曾剑鸿洪守玉吴睿叶浩屹叶益青辛晓妮
Owner DELTA ELECTRONICS (SHANGHAI) CO LTD