Thermal printing head capable of not only improving lettering quality but also prolonging service life

A thermal print head, quality technology, applied in the direction of printing device, printing, etc., to achieve the effect of improving service life, increasing printing density, and increasing service life

Pending Publication Date: 2020-05-15
SHANDONG HUALING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In order to solve the problems existing in the prior art, the present invention proposes a thermal print head that can improve both the printing quality and the service life, so as to improve the printing density by reducing the heat loss in the early stage of printing, and increase the heat Outward conduction to improve the tailing problem of the thermal print head and increase the service life

Method used

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  • Thermal printing head capable of not only improving lettering quality but also prolonging service life
  • Thermal printing head capable of not only improving lettering quality but also prolonging service life
  • Thermal printing head capable of not only improving lettering quality but also prolonging service life

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Embodiment Construction

[0019] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0020] Such as Figure 1-3 As shown, the thermal printhead that can improve the printing quality and service life involved in the present invention includes a ceramic substrate 1, on which a lead-free amorphous glass underglaze layer 2 is fully or partially printed, Sinter the ceramic substrate 1 with the underglaze layer 2 at a temperature of 1200°C-1300°C; then print and sinter the conductive paste on the surface of the ceramic substrate 1 and the underglaze layer 2 at a sintering temperature of 800°C-920°C, and then use it up Common electrodes 4 and individual electrodes 5 are formed by engraving technology, and then strip-shaped coating is carried out along the main printing direction of the thermal print head, and sintered at a temperature of 780°C-850°C to form a heating resistor 3 with a thickness of 4 μm to 8 μm; image 3 As shown, ...

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Abstract

The invention provides a thermal printing head capable of not only improving the lettering quality but also prolonging the service life. A groove is formed in a base platform in the main printing direction and corresponds to a heating resistor body in position, and a first solid material layer and a second solid material layer are sequentially arranged in the groove from bottom to top, wherein a solid material in the first solid material layer has a preset thermal expansion coefficient, and a solid material in the second solid material layer has preset elasticity and thermal conductivity; anda gap is reserved between the upper surface of the second solid material layer and the lower surface of a ceramic substrate, after the solid material in the first solid material layer expands thermally, the second solid material layer can make contact with the ceramic substrate, and heat generated by the heating resistor body is conducted onto the base platform through the second solid material layer. According to the thermal printing head, the printing concentration can be improved by reducing heat dissipation in the early stage of printing, by increasing outward heat conduction in the laterstage of printing, the tailing problem of the thermal printing head is relieved, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of thermal printing, in particular to a thermal printing head capable of improving printing quality and service life. Background technique [0002] As we all know, a thermal print head includes a substrate made of insulating material, on which an underglaze layer is arranged, and a wire electrode is arranged above the underglaze layer. The ones connected with the control IC are called individual electrodes, and the ones connected to the heating resistor and the printing power supply along the sub-printing direction are called common electrodes. A protective layer is provided, the substrate and the PCB are pasted on the metal base with adhesive tape, and the connection between the substrate and the PCB is encapsulated with epoxy resin or other encapsulation glue. [0003] In the early stage of thermal printing, the overall basic temperature of the thermal print head is equal to the ambient temperature. Due t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/32B41J2/335B41J29/393
CPCB41J2/32B41J2/3358B41J29/393
Inventor 朱丽娜孙华刚孙玉萌
Owner SHANDONG HUALING ELECTRONICS
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