Ultra-thin vapor chamber and manufacturing process thereof

Abstract

The invention discloses an ultra-thin vapor chamber and a manufacturing process thereof. The vapor chamber comprises a cover plate, a bottom plate and a porous capillary structure arranged between thecover plate and the bottom plate; a plurality of supporting columns are fixedly connected to the inner side wall of the cover plate, and a plurality of buckling parts corresponding to the supportingcolumns are arranged on the inner side wall of the bottom plate; a first protruding part is fixedly arranged at the end of one side of the cover plate, and a first groove is formed in the inner wall of the first protruding part; a second protruding part is fixedly arranged at the end of one side of the bottom plate, a second groove is formed in the inner wall of the second protruding part, and a vacuumizing pipe / liquid injecting pipe is welded between the first groove and the second groove in a penetrating mode; and the porous capillary structure is a special-shaped porous capillary structure, and the porous capillary structure is in an asterisk shape or other shapes. According to the ultra-thin vapor chamber which is large and thin, when the total thickness of products is smaller than 0.4 mm, it is guaranteed that the saturated steam flowing space is increased by 30 %-50 %, and the overall heat dissipation performance can be improved by 30% or above.

Description

technical field [0001] The invention relates to the technical field of heat conduction materials, in particular to an ultra-thin uniform temperature plate and a manufacturing process thereof. Background technique [0002] With the advent of 5G, more and more consumers have put forward more and stronger functions for various electronic consumer devices, which not only leads to the increase of the electric power and heat dissipation power of these electronic devices, but also leads to the traditional graphite or copper foil The temperature control of the heating device cannot be controlled, resulting in poor user experience or short product life. For example, the user feels hot when holding the mobile phone, and crashes or frequency drops when using certain programs. Relevant foreign team research and statistics show that when similar problems occur, 96.3% of the problems are attributed to the overtemperature of the core device of the product, because the overtemperature of th...

AI Technical Summary

Problems solved by technology

[0004] When the existing vapor chamber is made into an ultra-thin vapor chamber, its heat dissipation efficiency will be limited

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