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Scribing method

A technology of dicing and pre-scribing, applied in the direction of work accessories, manufacturing tools, glass manufacturing equipment, etc., can solve problems such as damage, cracked substrates, inability to properly divide substrates, etc., to achieve the effect of easy division and prevention of damage

Active Publication Date: 2022-04-29
TOP ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the scribing wheel pressurizes the substrate with a large pressure, there is a problem that cracks occur in the substrate in an unexpected direction or the substrate is broken, resulting in that the substrate cannot be properly divided.

Method used

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Examples

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Embodiment Construction

[0032] Hereinafter, a dicing method according to an embodiment of the present invention will be described with reference to the drawings.

[0033] refer to figure 1 and figure 2 , the direction of transferring the substrate S to be subjected to the scribing process is defined as the Y-axis direction, and the direction perpendicular to the direction of transferring the substrate S (Y-axis direction) is defined as the X-axis direction. In addition, the direction perpendicular to the direction of the X-Y plane on which the substrate S is placed is defined as the Z-axis direction. In addition, the term "scribing line" refers to grooves and / or cracks extending in a predetermined direction on the surface of a substrate. In addition, the term "line to cut" refers to a virtual line that will form a scribe line.

[0034] Such as Figure 1 to Figure 2 As shown, the scribing device applying the scribing method according to the embodiment of the present invention may include: a suppo...

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PUM

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Abstract

The scribing method according to an embodiment of the present invention is a method of forming a scribe line on a substrate along a virtual planned cutting line including a first section and a second section connected continuously, wherein the scribing method includes: a step of irradiating a laser beam along the planned cutting line to form dots in an interval; In the step of forming the scribing line by moving the planned cutting line, the pressing force of the scribing wheel in the first section is smaller than the pressing force of the scribing wheel in the second section.

Description

technical field [0001] The invention relates to a scribing method for forming scribing lines on a substrate. Background technique [0002] Generally, liquid crystal display panels, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projector substrates, reflective projector substrates, etc. used for flat panel displays use cell glass panels (hereinafter referred to as "cell Substrate"), the unit glass panel is obtained by cutting a brittle mother glass panel (hereinafter referred to as "substrate") such as glass into a predetermined size. [0003] The process of cutting the substrate includes: a scribing process, which is to press and move a scribing wheel made of a material such as diamond to the substrate along a virtual predetermined cutting line to form a scribing line; a splitting process, and the splitting process The substrate is divided into unit substrates by pressing the substrate along the scribe lines. [0004] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D1/22B28D7/00H01L21/78
CPCB28D1/225B28D1/221B28D7/00H01L21/78C03B33/033C03B33/082H01L21/76Y02P40/57
Inventor 张喜童
Owner TOP ENG CO LTD