Heat-conducting gel with good repairable performance and preparation method thereof

A gel and repair technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve problems such as substandard performance, affecting production line work efficiency, powder residue surface, etc., to improve service life and stability. , Improve stability and repair performance, reduce the effect of interface residues

Inactive Publication Date: 2020-06-05
SHENZHEN DARBOND INTERFACE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of component assembly or testing, some components may fail to meet performance standards due to various problems. It may be that a very small component causes the entire PCB to fail to work normally, and scrapping the entire PCB will cause great damage. Waste of resources, so rework process is necessary
However, due to the excessive addition of powder and the extremely low degree of crosslinking of ordin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] Example 1

[0022] A thermally conductive gel with good reworkability. Its components in parts by weight include: methyl fluorosilicone oil (viscosity of 500mPa·s, fluorine content of 0.5wt%) 80 parts, vinyl fluorosilicone oil (ethylene Base content is 0.4wt%, fluorine content is 0.5wt%, viscosity is 300mPa·s) 30 parts, hydrogen-containing fluorosilicone oil (active hydrogen content is 0.2wt%, fluorine content is 0.3wt%) 4 parts, platinum catalyst 0.5 parts , 2 parts of decyltriethoxysilane, 700 parts of spherical alumina (particle size 30μm), 500 parts of crushed alumina (particle size 4μm) and 80 parts of zinc oxide (particle size 3000 mesh).

[0023] The steps of the above-mentioned preparation method of thermally conductive gel are as follows:

[0024] (1) Combine 80 parts of methyl fluorosilicone oil (with a viscosity of 500mPa·s and a fluorine content of 0.5wt%), a vinyl fluorosilicone oil (with a vinyl content of 0.4wt%, a fluorine content of 0.5wt%, and a viscosity of...

Example Embodiment

[0026] Example 2

[0027] A thermally conductive gel with good reworkability. Its components include, in parts by weight: 100 parts of methyl fluorosilicone oil (viscosity of 300 mPa·s, fluorine content of 0.9 wt%), vinyl fluorosilicone oil (ethylene Base content is 0.3wt%, fluorine content is 0.7wt%, viscosity is 150mPa·s) 50 parts, hydrogen-containing fluorosilicone oil (active hydrogen content is 0.4wt%, fluorine content is 0.4wt%) 4 parts, platinum catalyst 0.7 parts , 4 parts of decyl triethoxysilane, 500 parts of spherical alumina (particle size 20μm), 800 parts of crushed alumina (particle size 2μm) and 100 parts of zinc oxide (particle size of 3000 mesh).

[0028] The steps of the above-mentioned preparation method of thermally conductive gel are as follows:

[0029] (1) 100 parts of methyl fluorosilicone oil (viscosity of 300mPa·s, fluorine content of 0.9wt%), vinyl fluorosilicone oil (vinyl content of 0.3wt%, fluorine content of 0.7wt%, viscosity of 150mPa·s) ) 50 parts, ...

Example Embodiment

[0031] Example 3

[0032] A thermally conductive gel with good reworkability. Its components in parts by weight include: methyl fluorosilicone oil (viscosity 100mPa·s, fluorine content 0.2wt%) 60 parts, vinyl fluorosilicone oil (ethylene Base content is 0.5wt%, fluorine content is 0.3wt%, viscosity is 500mPa·s) 60 parts, hydrogen-containing fluorosilicone oil (active hydrogen content is 0.3wt%, fluorine content is 0.1wt%) 6 parts, platinum catalyst 0.9 parts , 3.5 parts of decyltriethoxysilane, 570 parts of spherical alumina (particle size 40μm), 1000 parts of crushed alumina (particle size 7μm) and 120 parts of zinc oxide (particle size of 3000 mesh).

[0033] The steps of the above-mentioned preparation method of thermally conductive gel are as follows:

[0034] (1) Mix 60 parts of methyl fluorosilicone oil (with a viscosity of 100mPa·s and a fluorine content of 0.2wt%), a vinyl fluorosilicone oil (with a vinyl content of 0.5wt%, a fluorine content of 0.3wt%, and a viscosity of 50...

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Abstract

The invention belongs to the technical field of heat-conducting gel, and particularly relates to heat-conducting gel with good repairable performance and a preparation method thereof. The methyl fluorosilicone oil, the vinyl fluorosilicone oil and the hydrogen-containing fluorosilicone oil are used, they combines dual properties of the silicone oil and the fluorocarbon compound, so that the silicone oil and fluorocarbon compound have excellent weather resistance, high and low temperature resistance, chemical stability, water and oil resistance and extremely low surface tension, and the stability and the repair performance of the heat-conducting gel are greatly improved by adding the silicone oil and the fluorocarbon compound into the heat-conducting gel as a lubricant, a defoamer, a release agent and a surface treating agent. In addition, by utilizing the demoulding property of the fluorosilicone oil, the interface residue of the glue on the electronic component can be reduced, and therepair efficiency is greatly improved. The thermal conductivity coefficient of the heat-conducting gel is 3.0 W/m.K, the heat-conducting gel is used for filling gaps between heating electronic elements such as mobile phones and radiators, the service life of the radiating elements is prolonged, the stability of the radiating elements is improved, and the heat-conducting gel can be used for a longtime at the temperature of -54 DEG C to 200 DEG C.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting gels, and in particular relates to a heat-conducting gel with good reworkability and a preparation method thereof. Background technique [0002] Thermally conductive gel is widely used in various electronic components to improve the service life of components. In the process of component assembly or testing, some components may fail to meet performance standards due to various problems. It may be that a very small component causes the entire PCB to fail to work normally, and scrapping the entire PCB will cause great damage. Waste of resources, so a rework process is essential. However, due to the excessive addition of powder and the extremely low degree of crosslinking of ordinary thermal conductive gels, the body strength is extremely low. During the repair process, new interface materials need to be replaced. There will be a layer of powder residue on the surface during repair, especial...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 万炜涛郭呈毅陈田安
Owner SHENZHEN DARBOND INTERFACE MATERIALS
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