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Silicon wafer cleaning method

A technology for cleaning silicon wafers and silicon wafers, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the problems of ineffective cleaning of silicon wafer impurities and poor cleaning effect

Pending Publication Date: 2020-06-09
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the method of cleaning silicon wafers is generally to just rinse the silicon wafers with water, which is not effective and cannot effectively clean the impurities formed by volatiles on the surface of the silicon wafers, especially metal impurities.

Method used

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  • Silicon wafer cleaning method

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] See figure 1 , the embodiment of the present invention provides a silicon wafer cleaning method, including step S1 to step S4:

[0020] S1, putting the silicon wafer into a cleaning solution for cleaning; wherein, the cleaning solution includes sulfuric acid, hydrofluoric acid and water;

[0021] Since the cleaning solution is mainly composed of sulfuric acid, hydrofluoric acid and water, the cleaning solution has a strong dissolving ability for impuri...

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Abstract

The invention discloses a silicon wafer cleaning method. The silicon wafer cleaning method comprises the steps: a silicon wafer is placed in cleaning solution to be cleaned, wherein the cleaning solution contains sulfuric acid, hydrofluoric acid and water; the silicon wafer is put into pure water for cleaning; the silicon wafer is put into a pickling solution for cleaning, wherein the pickling solution comprises hydrofluoric acid, hydrochloric acid and water; and the silicon wafer is put into pure water for cleaning. Metal impurities on the surface of the silicon wafer and impurities formed byvolatile matters can be effectively cleaned, and the cleaning effect of the silicon wafer is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a silicon wafer cleaning method. Background technique [0002] In the production of silicon wafers, the surface is often contaminated with various volatiles to form impurities, especially some metal impurities formed on the surface, which affects the processing effect of silicon wafers, and in severe cases, it will cause adverse effects on the subsequent processing and use of semiconductors. s consequence. Therefore, in the process of processing silicon wafers, silicon wafers must be cleaned. At present, the method of cleaning silicon wafers is generally to just rinse the silicon wafers with water, which is ineffective in cleaning and cannot effectively clean the impurities formed by volatile matter on the surface of the silicon wafers, especially metal impurities. Contents of the invention [0003] In view of the above problems, the purpose of the present invention is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02041
Inventor 程丙坤
Owner SAE TECH DELEVOPMENT DONGGUAN