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Microsemiconductor element structure

A semiconductor and component technology, applied in the field of micro-semiconductor component structure, can solve the problems that the support layer affects the process and the performance of micro-light-emitting diodes is reduced.

Pending Publication Date: 2020-06-12
PLAYNITRIDE DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the micro-LEDs are transferred to the receiving substrate, the supporting layer may remain on the micro-LEDs and affect the subsequent process, reducing the efficiency of the micro-LEDs

Method used

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  • Microsemiconductor element structure
  • Microsemiconductor element structure
  • Microsemiconductor element structure

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Embodiment Construction

[0063] The following content provides many different embodiments or examples for implementing different components of the embodiments of the present invention. Specific examples of components and configurations are described below to simplify embodiments of the invention. Of course, these are just examples, not intended to limit the embodiments of the present invention. For example, if it is mentioned in the description that the first component is formed on the second component, it may include an embodiment in which the first and second components are in direct contact, and may also include an additional component formed between the first and second components, An embodiment such that the first and second parts are not in direct contact. In addition, the embodiments of the present invention may repeat element symbols and / or letters in many examples. These repetitions are for the purposes of simplicity and clarity and do not in themselves imply a specific relationship between...

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Abstract

The embodiment of the invention discloses a microsemiconductor element structure. In some embodiments, the microsemiconductor element structure may include a substrate, a plurality of microsemiconductor elements disposed over the substrate, and a plurality of first support layers disposed between the substrate and the microsemiconductor elements. Each micro semiconductor element is provided with afirst electrode and a second electrode, the first electrodes and the second electrodes are arranged on the lower surfaces of the micro semiconductor elements, each lower surface comprises an area, and each area is arranged between the corresponding first electrode and the corresponding second electrode. The orthographic projection of the first support layers on the substrate at least partially overlaps with the orthographic projection of the area on the substrate. The first support layers are in direct contact with the area.

Description

technical field [0001] The present invention relates to semiconductor structures, and more particularly to micro-semiconductor element structures. Background technique [0002] With the advancement of optoelectronic technology, the volume of many optoelectronic components is gradually miniaturized. Due to breakthroughs in the size of light emitting diodes (LEDs) in recent years, micro light emitting diode (Micro LED) displays, in which light emitting diodes are arranged in an array, are gradually gaining attention in the market. Micro-LED displays are active micro-semiconductor device displays. Compared with organic light-emitting diode (Organic Microsemiconductor Diode, OLED) displays, they are more energy-efficient and have better contrast performance. They can be used in sunlight Has visibility. In addition, since the micro light emitting diode display uses inorganic materials, it has better reliability and a longer service life than the organic light emitting diode dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15
CPCH01L27/156
Inventor 吴志凌刘应苍陈培欣史诒君陈奕静李玉柱张桓仆罗玉云苏义闵林子旸赖育弘
Owner PLAYNITRIDE DISPLAY CO LTD