Stamping die for FPC board
A technology of stamping dies and dies, which is applied in the field of FPC manufacturing, can solve problems such as pollution and difficult cleaning of liquid medicine, and achieve the effects of no pollution to the environment, low cost, and simple structure
Inactive Publication Date: 2020-06-19
黄石市联翔电子有限公司
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Problems solved by technology
[0002] The burr-free FPC board needs to be etched during the production process, which is chemically etched, which has certain pollution, and the chemical solution is difficult to clean
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[0008] see figure 1 , The present embodiment includes a forming die 1 and a back pressure die 2, the forming die 1 is provided with a forming punch 11 and a guide post 12, and the back press die 2 is provided with a back pressure punch 21 and a back pressure guide post 22.
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The invention relates to the technical field of FPC manufacturing, in particular to a stamping die for an FPC board. The stamping die comprises a forming die and a back-pressing die, wherein the forming die is provided with forming stamping heads and guide columns; and the back-pressing die is provided with back-pressing stamping heads and guide columns. The stamping die has no pollution and low cost.
Description
technical field [0001] The invention relates to the technical field of FPC manufacturing, in particular to a stamping die for FPC boards. Background technique [0002] The burr-free FPC board needs to be etched during the production process, which is chemically etched, which has certain pollution, and the chemical solution is difficult to clean. Contents of the invention [0003] The object of the present invention is to provide a stamping die for FPC board in order to solve the above problems. [0004] The specific solution of the present invention is: a stamping die for FPC boards, including a forming die and a back pressing die, the forming die is provided with a forming stamping head and a guide column, and the back pressing die is provided with a back pressing punch and a guide post . [0005] Compared with the prior art, the present invention has the following advantages: simple structure, low cost, no pollution to the environment, and can also produce burr-free FP...
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IPC IPC(8): B21D37/10
CPCB21D37/10
Inventor 吴朝阳
Owner 黄石市联翔电子有限公司
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