Micro clamp device with adjustable and controllable internal stress

Abstract

The invention discloses a micro clamp device with an adjustable and controllable internal stress. The micro clamp device comprises a clamp seat, a sliding block and a spiral micrometer head, the sliding block and the spiral micrometer head are both movably arranged on the clamp base, a first baffle and a second baffle are arranged on the two sides of the clamp base, a trapezoidal sliding groove isformed in the clamp base, a pin hole is formed in one side of the trapezoidal sliding groove, two triangular grooves are distributed in the first baffle in a mirroring mode, a threaded hole is formedin the second baffle, and the spiral micrometer head can drive the sliding block to slide. The sliding block comprises an upper baffle and a lower sliding block, a reverse triangular groove is formedin the upper baffle, and a fixing groove matched with the pin is formed in the side wall of one end of the lower sliding block; and spring pieces are arranged in the corresponding triangular groovesbetween the clamp base and the sliding block. The micro clamp device is simple in structure and convenient to use, the bending degree of the sample can be adjusted and controlled under the condition that the size and the weight are limited, and then real-time bending of the sample and accurate adjustment and control over the corresponding internal stress state are achieved, and more accurate experimental data are obtained.

Description

technical field [0001] The invention belongs to the technical field of experimental instruments, and in particular relates to a micro-clamp device with adjustable internal stress. Background technique [0002] In recent years, due to its outstanding extensibility, adaptability and portability, flexible electronics has shown great application prospects in the fields of communication and wearables, and has become a hot spot pursued and researched by the electronics industry and academia. The biggest feature that distinguishes flexible electronics from traditional microelectronics is "flexibility", that is, it is required to have the ability to withstand large deformations, and at the same time, the original electromechanical characteristics must remain stable after repeated deformations. As the most common deformation method in flexible electronics applications, bending will inevitably bring about changes in the internal stress of flexible materials, which may affect the elect...

AI Technical Summary

Problems solved by technology

The processing or scanning objects of the existing atomic force microscope are limited to samples with a fixed shape, and there is a lack of a sample stage device that can bend the test sample and control the internal stress of the material in real time

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