Via Post-Sensing Layer Distributor for Minimizing Latency and Overflow in Advanced Process
An advanced process and through-hole column technology, which is applied in the fields of instrumentation, computing, electrical and digital data processing, etc., can solve the problems of increased coupling capacitance, increased linear density, increased delay, etc., and achieves strong practicability and wide application. Effects of foreground, optimization delay and overflow
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[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0033] Non-default ruled lines:
[0034] The lineweight of non-default ruled lines is different from the default lineweight. Specifically, the default line widths of different wiring layers are different. The default lineweight of the upper layer is usually larger than the default lineweight of the lower layer. The comparison between the non-default ruled line and the default ruled line is as follows figure 2 shown. exist figure 2 In (a), two pins are connected using parallel lines and default ruled lines respectively, wherein the default ruled line occupies one routing track and the parallel line occupies two routing tracks. exist figure 2 In (b), the two pins are connected using a wide line and a default ruled line, respectively, where the default ruled line occupies one routing track and the wide line occupies three routin...
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