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Via Post-Sensing Layer Distributor for Minimizing Latency and Overflow in Advanced Process

An advanced process and through-hole column technology, which is applied in the fields of instrumentation, computing, electrical and digital data processing, etc., can solve the problems of increased coupling capacitance, increased linear density, increased delay, etc., and achieves strong practicability and wide application. Effects of foreground, optimization delay and overflow

Active Publication Date: 2022-05-10
FUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In addition, each routing layer has an upper limit on routing resources
Routability will deteriorate and line density will increase if too many lines are allocated to upper layers, or if via posts, non-default ruled lines are used excessively
Due to coupling effects, an increase in line density will lead to an increase in coupling capacitance, which in turn will cause an increase in time delay, which has a negative impact on the timing characteristics of the circuit

Method used

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  • Via Post-Sensing Layer Distributor for Minimizing Latency and Overflow in Advanced Process
  • Via Post-Sensing Layer Distributor for Minimizing Latency and Overflow in Advanced Process
  • Via Post-Sensing Layer Distributor for Minimizing Latency and Overflow in Advanced Process

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0033] Non-default ruled lines:

[0034] The lineweight of non-default ruled lines is different from the default lineweight. Specifically, the default line widths of different wiring layers are different. The default lineweight of the upper layer is usually larger than the default lineweight of the lower layer. The comparison between the non-default ruled line and the default ruled line is as follows figure 2 shown. exist figure 2 In (a), two pins are connected using parallel lines and default ruled lines respectively, wherein the default ruled line occupies one routing track and the parallel line occupies two routing tracks. exist figure 2 In (b), the two pins are connected using a wide line and a default ruled line, respectively, where the default ruled line occupies one routing track and the wide line occupies three routin...

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Abstract

The present invention relates to a via post sensing layer allocator that minimizes time delay and overflow under an advanced manufacturing process. The via post sensing layer allocator designs a layer allocation scheme according to the following steps: S1) Generate an initial solution for the subsequent stage; Apply the multi-angle congestion relaxation strategy to evaluate the congestion and then adjust the layer allocation scheme; S2) Based on the initial solution, apply the idea of ​​negotiation to guide the layer allocation; S3) Use the network healing algorithm to optimize the maximum delay of the current layer allocation scheme; S4) Sort all the nets according to the delay and redistribute them; give priority to the nets with large delays, that is, sequence-critical nets, and use the via post optimization method for the top timing-critical nets, combining via posts and non-default Rule lines to further reduce latency and generate the final layer assignment scheme. The via post-aware layer allocator can optimize delay and overflow under the premise of considering via congestion, wire congestion and coupling effects.

Description

technical field [0001] The invention belongs to the technical field of computer-aided design of integrated circuits, and in particular relates to a through-hole column sensing layer distributor which minimizes time delay and overflow under an advanced manufacturing process. Background technique [0002] As one of the important factors affecting chip performance, interconnection delay is an important optimization target in layer assignment. The line delay mainly includes the line delay and the via delay. However, with the expansion of the circuit scale, the wire resistance and the via resistance increase significantly, which directly leads to the increase of the wire network delay. In advanced processes, the upper layer has a larger line width and line spacing than the lower layer, so the resistance of the upper layer lines is lower. Therefore, allocating timing-critical network segments to the upper layer is beneficial to reduce delay. But this method alone is not enough ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/392
CPCG06F30/392
Inventor 郭文忠张星海刘耿耿黄兴陈国龙
Owner FUZHOU UNIV