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Cover film laminating machine with half-cutting structure

A covering film and laminating machine technology, applied in lamination auxiliary operations, secondary processing of printed circuits, metal processing, etc., can solve problems such as resource waste, cover film damage, unsatisfactory, etc., to improve work efficiency and ensure cutting Cutting accuracy, improve the effect of conveying efficiency

Pending Publication Date: 2020-07-03
苏州福莱科斯电子科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former method is more difficult to peel off, and it is easy to cause damage to the cover film, affecting product performance, and it is difficult to recycle the release paper, resulting in waste of resources
The thickness of the cover film itself in the latter method is small, and the cutting accuracy is difficult to control; and generally, the cover film can only be cut in a straight line, which cannot meet the needs of FPCBs with special-shaped cover films.
[0003] In addition, the conveying mechanism of the cover film laminating machine in the prior art usually has only one working table, and other mechanisms need to wait during the moving and conveying process of the table, which greatly reduces the working efficiency of the equipment

Method used

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  • Cover film laminating machine with half-cutting structure
  • Cover film laminating machine with half-cutting structure
  • Cover film laminating machine with half-cutting structure

Examples

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Embodiment Construction

[0080] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0081] The first technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0082] Such as figure 1 As shown, a cover film laminating machine with a half-cut structure includes a workbench 10 on which a half-cut mechanism 40, a stripping mechanism 80, a transfer mechanism 604 and The FPCB loading mechanism 70 is p...

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Abstract

The invention provides a cover film laminating machine with a half-cutting structure. The machine comprises a workbench, a half-cutting mechanism, a stripping mechanism, a transfer mechanism and a feeding mechanism being sequentially arranged on one longitudinal side of the workbench; a roll type feeding mechanism, connected to one end of the workbench; a half-cutting mechanism comprising a cutting table; two cutters, arranged above the cutting table, and one cutter being a straight cutter; stop blocks arranged at the two ends of the cutters respectively, the cutters protruding downwards relative to the stop blocks, and the protruding height being larger than the thickness of the covering film and smaller than the thickness of the covering film and the release paper; two groups of half-cutting cylinders, respectively connected with the two cutters; a conveying mechanism, longitudinally arranged in the middle of the workbench; a laminating mechanism, arranged above the transfer mechanism through the first moving mechanism, and the discharging mechanism being arranged on one side of the feeding mechanism. The half-cutting mechanism is adopted, the cutting precision is high, and cutting of covering films of different shapes can be achieved. And according to the first technical scheme, the two conveying platforms are further arranged, and the overall working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of cover film bonding equipment, in particular to a cover film bonding machine with a half-cut structure. Background technique [0002] The cover film bonding equipment in the prior art generally cuts the cover film and the release paper together and then peels off the cover film, or cuts the cover film after peeling off the two. The former method is more difficult to peel off, and it is easy to cause damage to the cover film, affecting product performance, and it is difficult to recycle the release paper, resulting in waste of resources. The thickness of the cover film itself in the latter method is small, and the cutting accuracy is difficult to control; and generally, the cover film can only be cut in a straight line, which cannot meet the needs of FPCBs with special-shaped cover films. [0003] In addition, the conveying mechanism of the covering film laminating machine in the prior art usually has only...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28B32B38/10B32B38/00B26D11/00B26D1/08B26D7/00
CPCH05K3/28B32B38/10B32B38/0004B26D11/00B26D1/085B26D7/00B26D2007/0012
Inventor 代诗磊
Owner 苏州福莱科斯电子科技有限公司