Multilayer circuit board and preparation method thereof

Abstract

The invention discloses a multilayer circuit board and a preparation method thereof. The multilayer circuit board comprises: a plurality of circuit boards, wherein each circuit board comprises a coreboard layer which comprises a first metal layer and a second metal layer, the first metal layer and the second metal layer are respectively disposed on the upper surface and the lower surface of the core board layer, the first metal layer forms a first signal hole penetrating through the core plate layer and the first metal layer at a preset position, and the first signal hole exposes the second metal layer on the lower surface; and a first connecting circuit arranged in the first signal hole so as to electrically connect the first metal layer with the second metal layer, so that a circuit board is formed, wherein the multilayer circuit board is formed by stacking a plurality of circuit boards. By means of the mode, structural defects such as burrs existing in the multi-layer circuit boardcan be removed, and the stability of product quality is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a multilayer circuit board and a preparation method thereof. Background technique [0002] In order to improve the structure and performance of multilayer circuit boards, materials with smaller thickness or softer texture are usually selected as the core layer or bonding layer material of multilayer circuit boards. For materials with smaller thickness or softer texture, defects such as burrs will be generated during mechanical drilling, and these defects will seriously affect the quality of multilayer circuit boards. [0003] In the prior art, in order to remove the aforementioned structural defects such as burrs, chemical solutions are used to chemically corrode the structural defects such as the burrs. However, the process of chemical corrosion is not only complicated, but the concentration of liquid medicine is difficult to control, and it is impossible to ensure that ...

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Problems solved by technology

However, the process of chemical corrosion is not only complicated, but the concentration of the liquid medicine is difficult to control, and it is impossible to ensure that the burrs are completely clear. At the same time, the chemical corrosion method for materials with good chemical stability cannot solve the above defects at all, and the quality of the product is difficult to guarantee.

[0004] In the long-term research and development process, the inventor of the present application found that there are structural defects such as burrs in the existing multilayer circuit boards, and the product quality stability is poor

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