Etching solution, active component array substrate and method for manufacturing active component array substrate

A technology for array substrates and active components, applied in the field of active component array substrates, can solve problems such as easy heat release, poor stability, and adding stabilizers, and achieve the effects of avoiding structural defects, good etching performance, and high stability
CN101807572AInactive Publication Date: 2010-08-18AU OPTRONICS CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
AU OPTRONICS CORP
Publication Date
2010-08-18
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention provides etching solution, an active component array substrate and a method for manufacturing the active component array substrate. The active component array substrate is provided with at least one multi-layer patterned metallic layer, wherein the multi-layer patterned metallic layer is an aluminum / copper layer, an aluminum alloy / copper layer, an aluminum alloy / copper / aluminum alloy layer, a copper alloy / copper layer or a copper alloy / copper / copper alloy layer, and is etched by the etching solution; and the etching solution comprises water, 0.1 to 0.4 weight percent of nitric acid, 50 to 78 weight percent of phosphoric acid and 0.1 to 15 weight percent of acetic acid. The active component array substrate of the invention is endowed with relatively better electrical property.
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Description

technical field

[0001] The present invention relates to an active component array substrate, and in particular to an etching solution, an active component array substrate and a manufacturing method thereof. Background technique

[0002] As the size of the thin film transistor liquid crystal display (TFT-LCD) panel becomes larger and larger, it is accompanied by the resistance-capacitance (RC) delay effect caused by the resistance of the metal wire that is not low enough, thus causing distortion and distortion of the signal during transmission. , which affects the presentation of panel quality. Using low-resistance copper metal to form the metal wire can effectively reduce the RC delay effect. At the same time, a molybdenum layer is needed between the copper layer in the active component array substrate and the base material to prevent copper ions from diffusing into the base material. In terms of the etchant of the double-layer structure of the copper layer and the molybde...

Claims

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