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A kind of cob electronic encapsulation glue and preparation method thereof

An electronic packaging, epoxy resin technology, applied in the direction of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problems of affecting the coating ability of PCB boards, poor transparency of packaging glue, and large linear expansion coefficient. Achieve the effect of improving curing efficiency, low warpage rate and low moisture absorption rate

Active Publication Date: 2021-08-17
INST OF PROCESS ENG CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the packaging glue used in the COB glue filling process has poor transparency, high warpage rate, and large linear expansion coefficient, which affects the bonding and coating ability of the PCB board.

Method used

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  • A kind of cob electronic encapsulation glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a COB electronic packaging glue, which is characterized in that it consists of component A and component B. By weight, component A consists of 100 parts of bisphenol A diglycidyl ether, 5 parts of butyl glycidyl ether part, 100 parts of modified silica powder, 8 parts of accelerator, 0.2 part of organic silicon light diffusing powder (average particle diameter D50 2.0), 0.001 part of pigment carbon black; the composition of B component is 88 parts of acid anhydride composition, polyurethane toughening 5 doses;

[0031] The preparation method of the COB electronic encapsulation glue specifically includes the following steps

[0032] (1) Preparation of glue A: 100g of bisphenol A diglycidyl ether, 5g of butyl glycidyl ether, 100g of modified silicon powder, 8g of accelerator, 0.2g of organic silicon light diffusion powder, and 0.001g of pigment carbon black by mass Add to 1000mL beaker successively after weighing, mechanically stir for 10 minutes...

Embodiment 2

[0037] This embodiment provides a COB electronic packaging glue, which is characterized in that it consists of component A and component B. By weight, component A consists of 100 parts of bisphenol A diglycidyl ether, 7 parts of butyl glycidyl ether part, 110 parts of modified silicon powder, 12 parts of accelerator, 0.4 part of organic silicon light diffusion powder (average particle size D502.0), 0.001 part of pigment carbon black; the composition of B component is 92 parts of acid anhydride composition, polyurethane enhancer 6 parts of toughening agent;

[0038] The method of preparation and use is the same as in Example 1.

Embodiment 3

[0040] This embodiment provides a COB electronic packaging adhesive, which is characterized in that it consists of component A and component B. By weight, component A consists of 100 parts of bisphenol A diglycidyl ether, 4 parts of butyl glycidyl ether part, 90 parts of modified silicon powder, 6 parts of accelerator, 0.3 part of organic silicon light diffusion powder (average particle diameter D50 2.0), 0.001 part of pigment carbon black; the composition of component B is 86 parts of acid anhydride composition, polyurethane toughened 5 doses;

[0041]The method of preparation and use is the same as in Example 1.

[0042] In order to verify the technical effect of the present invention, the sample prepared in the embodiment of the present invention and the purchased commercial sealant were prepared as specimens for performance testing, focusing on hardness and water resistance.

[0043] Resin hardness test, use the LX-D model Shore hardness tester produced by Wenzhou Haibao ...

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Abstract

The invention belongs to the technical field of electronic encapsulation adhesives, in particular to a COB electronic encapsulation adhesive, which is characterized in that it consists of component A and component B, and the composition of component A is 100 parts of bisphenol A type epoxy resin by weight , 3-8 parts of diluent, 80-120 parts of filler, 5-15 parts of accelerator, 0.1-0.5 part of light diffusing powder, 0.001 part of black pigment; the composition of component B is 80-100 parts of acid anhydride, 3 parts of toughening agent ‑10 servings. The beneficial effects of the present invention are: (1) using the ionic liquid composition as an accelerator, the system also has high toughness while improving the curing efficiency; (2) the effective gradation of the filler system improves the encapsulation Hardness; (3) Through the effective combination of acid anhydride curing agent and toughening agent, it can not only maintain a moderate curing speed when encapsulating the colloid, but also have small shrinkage after curing, low warpage rate, and low moisture absorption rate.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging glue, and in particular relates to a COB electronic packaging glue and a preparation method thereof. Background technique [0002] Although LED, as a green and energy-saving light source, has been vigorously developed in recent years, its photoelectric conversion efficiency is low, and most of the electrical energy is converted into heat energy. With the increase of LED power, its calorific value also gradually increases. If the generated heat cannot be dissipated in time, it will greatly affect the normal operation of LED and shorten its service life. [0003] COB (Chips on Board) is a technology to solve the problem of LED heat dissipation. Compared with in-line and SMD, it is characterized by saving space, simplifying packaging operations, and having efficient thermal management. This technology is to adhere the bare chip on the interconnect substrate with conductive or non-condu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C08G59/42
CPCC08G59/4207C08G59/4215C08G59/4223C08L2203/206C09J11/04C09J11/06C09J11/08C09J163/00C08L75/04C08K13/06C08K9/06C08K3/36C08K5/55C08K5/44C08K3/04
Inventor 刘龙王清晨姜智一张延强张锁江
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI