Multi-type T/R assembly microstrip plate batch test interconnector

Abstract

The invention relates to a multi-type T / R assembly microstrip plate batch test interconnector which comprises an interconnection carrier. The interconnection carrier is fastened at the upper end of abase through a captive screw; a radio frequency interconnection microstrip plate is arranged on the interconnection carrier; feeder pads are distributed on the microstrip plate to be measured according to different types, models and specifications. A matched feeder line is correspondingly arranged on the radio frequency interconnection microstrip plate. The required radio frequency interconnectionmicrostrip plate can be rapidly replaced according to different test requirements. The radio frequency interconnection microstrip plate is provided with a radio frequency feed elastic sheet. One endof the radio frequency feed elastic sheet is welded on a matched feeder line, and the other end of the radio frequency feed elastic sheet is elastically pressed on a microstrip plate feed bonding padto be tested when the interconnection carrier is tightly matched with the base, so that signal interconnection is realized. Two diagonal positioning pins are arranged on the base, so that the microstrip plate to be tested can be accurately mounted on the metal base. The grounding performance is good, and meanwhile, the test reliability is enhanced.

Description

technical field [0001] The invention belongs to the technical field of microwave testing and relates to an interconnector, in particular to an interconnector used for batch testing of multi-type T / R component microstrip boards. Background technique [0002] The continuous development of two-dimensional active phased array radar technology has made each component module develop towards miniaturization and high-density integration, and at the same time, the requirements for the diversity and completeness of electronic functions are also gradually increasing. As an important part of active phased array radar, T / R components have a large number, and in order to realize various functional requirements, microstrip boards of different types and specifications may be designed inside each T / R component. To ensure engineering reliability, the electrical performance of the microstrip board needs to be uniformly tested before being loaded into the formal housing of the component. This m...

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Problems solved by technology

[0005] In order to avoid the deficiencies of the prior art, the present invention proposes a multi-type T / R assembly microstrip board batch test interconnector, which mainly solves the following two problems: 1. T / R assemblies of different types and models It is cumbersome and time-consuming to weld multiple SMA connectors for each microstrip board to be tested during batch testing of microstrip boards, and repeated disassembly and assembly of SMA connectors will damage the feed pad; 2. Poor grounding, poor test reliability, and affect test results

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