Supercharge Your Innovation With Domain-Expert AI Agents!

Circuit board roll-leveling device and using method thereof

A circuit board and rolling device technology, which is applied in printed circuit, printed circuit manufacturing, printed circuit secondary processing, etc., can solve the problem of huge cost of consumables, and achieve the effect of saving processing costs

Active Publication Date: 2020-07-17
GRP UP IND CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, prior art circuit board leveling devices rely heavily on disposable transparent plastic films to take excess ink away from the circuit board, so the use of consumables The cost is very large, and the use of a large number of transparent plastic films also has a negative impact on the environment, so the leveling device of the prior art has its defects

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board roll-leveling device and using method thereof
  • Circuit board roll-leveling device and using method thereof
  • Circuit board roll-leveling device and using method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] The technical features adopted by the present invention to achieve the predetermined creation purpose are further described below in conjunction with the accompanying drawings and preferred embodiments of the present invention.

[0053] see figure 1 As shown, the circuit board rolling device of the present invention includes a conveying track 10, a rolling component 20 and at least one ink removal device.

[0054]The conveying track 10 extends along a conveying direction L, and opposite ends thereof along the conveying direction L are a front end 11 and a rear end 12 respectively.

[0055] see figure 1 and figure 2 As shown, the rolling assembly 20 includes an upper roller 21, a lower roller 22, a mobile power unit 23, an upper roller rolling device 24 and a lower roller rolling device 25, and the upper roller 21 and the upper roller rolling device 24 are arranged on the conveying track 10 The upper roller rolling device 24 can drive the upper roller 21 to rotate ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a circuit board roll-leveling device and a using method thereof. The circuit board roll-leveling device comprises a conveying track, a roll-leveling assembly, an upper ink removing device and a lower ink removing device, the roll-leveling assembly comprises an upper roller and a lower roller, and the upper roller and the lower roller are respectively arranged at the upper side and the lower side of the conveying track. The upper ink removing device comprises an upper scraper and an upper bearing disc, the upper scraper is attached to the upper roller and can be used forscraping ink adhering to the upper roller and enabling the ink to fall into the upper bearing disc downwards, and the lower ink removing device comprises a lower scraper and a lower bearing disc and is symmetrical with the upper ink removing device. Due to the arrangement of the upper scraper and the lower scraper, after the ink on the upper roller and the lower roller is scraped off, the rollerscan be used for adhering the ink again, and therefore the need for using a disposable ink adhering device is omitted.

Description

technical field [0001] The invention relates to a circuit board processing device, in particular to a device capable of pressing and removing excess solder resist ink on the circuit board. Background technique [0002] In the field of circuit board processing, how to remove excess solder resist ink on the circuit board is an important technology; the so-called excess solder resist ink refers to the periphery of the plug hole coated on the circuit board to prevent circuit short circuit The ink; these inks are easy to plug the hole during the manufacturing process, and then the ink will ooze from both sides of the plug hole and form arc-shaped bumps at the end of the plug hole. Bumps are processing defects that must be rolled out and removed during board processing. [0003] see Figure 8 Shown, and the circuit board leveling device of prior art, it passes a conveyer belt (not shown in the figure), and circuit board 91 is sent between two rollers 92 that are arranged at inter...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/288H05K2203/0139H05K2203/0143
Inventor 陈安顺
Owner GRP UP IND CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More