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high frequency transmission line

A high-frequency transmission and transmission line technology, applied in high-frequency matchers, circuits, circuit devices, etc., can solve the problems of difficulty in mass production of high-frequency transmission lines and small diameter of signal through holes.

Active Publication Date: 2021-10-01
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result of detailed studies by the inventors, it was found that when using the above-mentioned high-frequency transmission line for single-mode transmission of high-frequency signals, it is necessary to make the diameter of the signal via hole very small, and the high-frequency transmission line Issues such as difficulty in mass production of

Method used

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Examples

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Effect test

Embodiment 1

[0046]

[0047] The high-frequency transmission line of the present disclosure is used for transmission of high-frequency signals, especially high-frequency signals of a frequency above 70 GHz, and specifically for supplying power to antennas.

[0048] First, refer to figure 1 as well as figure 2 , the configuration of the high-frequency transmission line 10 of Example 1 in the first embodiment will be described. The high-frequency transmission line 10 includes a multilayer substrate 2 , signal lines 3 and 4 , a signal via 5 , and six through holes 7 .

[0049] The multilayer substrate 2 has two dielectric layers L1, L2, and three pattern layers P1 to P3 sandwiching each of the dielectric layers L1, L2. Hereinafter, among the pattern layers P1 to P3, the pattern layers P1 and P3 disposed on the outer surface of the multilayer substrate 2 are referred to as outer layers, and the pattern layer P2 disposed between the dielectric layers L1 and L2 is referred to as an intermed...

Embodiment 2

[0067] Next, in Figure 7 as well as Figure 8 In , the high-frequency transmission line 10a of Example 2 in the first embodiment is shown. The high-frequency transmission line 10a includes a multilayer substrate 2a, signal lines 3 and 4, a signal via 5, six through holes 7, and two interlayer vias 7a.

[0068] The multilayer substrate 2 a includes three dielectric layers L1 to L3 and four pattern layers P1 to P4 sandwiching each of the dielectric layers L1 to L3 . Hereinafter, among the pattern layers P1 to P4, the pattern layers P1 and P4 arranged on the outer surface of the multilayer substrate 2a are referred to as outer layers, and the other pattern layers P2 and P3 are referred to as intermediate layers.

[0069] On the outer layers P1, P4, signal lines 3, 4 are formed. Furthermore, ground planes 6 are formed on the intermediate layers P2 and P3, respectively. Furthermore, two interlayer via holes 7a are formed in the multilayer substrate 2a. The two interlayer via ...

Embodiment 3

[0075] Next, in Figure 9 In , the high-frequency transmission line 10b of Example 3 in the first embodiment is shown. The high-frequency transmission line 10b includes a multilayer substrate 2b, signal lines 3 and 4, signal vias 5, and eight interlayer vias 7a. In other words, the high-frequency transmission line 10b differs from the high-frequency transmission line 10a in that six interlayer vias 7a are provided instead of the six through-holes 7, and all the ground vias are interlayer vias 7a.

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Abstract

In the high-frequency transmission line of the present disclosure, the through-hole diameter of the signal through-hole is formed to a size such that a high-frequency signal propagates through multi-mode interference transmission. In addition, at least one of the via-hole distance between the signal via hole and the ground via hole, the diameter of the via hole, and the substrate thickness of the multilayer substrate is formed so that a high-frequency signal is transmitted from the interlayer in a strong region of multimode interference transmission. The line leads to the signal line.

Description

[0001] Cross References to Related Applications [0002] This international application claims priority based on Japanese Patent Application No. 2017-206232 filed with the Japan Patent Office on October 25, 2017, and the entire contents of Japanese Patent Application No. 2017-206232 are incorporated into this international application by reference. technical field [0003] The present disclosure relates to a technique of transmitting a high-frequency signal in a lamination direction of a multilayer substrate. Background technique [0004] Patent Document 1 below describes a technique for forming a high-frequency transmission line having a coaxial line structure having signal via holes connecting signal line patterns formed on both sides of a multilayer wiring board, and Ground vias with ground potential arranged around a circle centered on the signal via. [0005] Patent Document 1: Japanese Patent Laid-Open No. 2015-50680 [0006] In high-frequency transmission lines with...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/08H05K3/46
CPCH05K3/46H01P5/028H01P3/082H01P3/088H01P3/121H05K1/0251H01P5/085
Inventor 樱井一正胁田和弥角谷祐次
Owner DENSO CORP