Material mounting method and device, electronic equipment and storage medium

A material and placement technology, applied in image data processing, instruments, calculations, etc., can solve problems such as difficulty in ensuring product consistency and long time-consuming production transfer, and achieve product consistency, accurate placement position, and efficient production transfer methods Effect

Pending Publication Date: 2020-07-24
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the above-mentioned production conversion method has the problems that it takes a long time

Method used

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  • Material mounting method and device, electronic equipment and storage medium
  • Material mounting method and device, electronic equipment and storage medium
  • Material mounting method and device, electronic equipment and storage medium

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Embodiment Construction

[0050] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0051] It can be understood that the terms "first", "second" and the like used in this application may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first client could be termed a second client, and, similarly, a second client could be termed a first client, without departing from the scope of the present application. Both the first client and the second client are clients, but they are not the same client.

[0052] figure 1 It is a...

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Abstract

The embodiment of the invention provides a material mounting method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring a mainboard image by image acquisition equipment; determining the actual location of a motherboard, according to the actual position of the main board, the target position of the material and the position of the suction nozzle, determining the mounting position of the material, controlling the suction nozzle to suck the material, moving the material to the mounting position, so that manual operation for transfer is avoided, the automatic transfer mode is more efficient, and product consistency can be guaranteed even for products of different lines.

Description

technical field [0001] The present application relates to the field of mounting, in particular to a material mounting method, device, electronic equipment and storage medium. Background technique [0002] In the motherboard production process of mobile phones, computers, iPads and other terminals, a series of auxiliary materials need to be mounted on the motherboard after dispensing and before shipment. For example, waterproof cushions, waterproof stickers, copper foil, Conductive foam, etc. are mounted on the motherboard. [0003] At present, most of the industry uses auxiliary material machines to automatically complete the auxiliary material placement. The process of switching from the production of one product to another is called production change. When the current auxiliary material machine is changing production, it usually adopts the method of manual conversion. For example, for each material, it is necessary to manually operate the manipulator to adjust the auxili...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/70
CPCG06T7/0004G06T7/70G06T2207/30164
Inventor 李戴
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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