Heat dissipation device for computer equipment
A technology for computer equipment and heat dissipation devices, applied in the field of heat dissipation devices for computer equipment, can solve the problems of poor sound insulation performance of the built-in heat dissipation fan, affect user experience, poor heat dissipation performance, etc., and achieve convenient discharge, increase convenience, and increase functions. sexual effect
Active Publication Date: 2020-07-28
安徽海佩电子科技有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a cooling device for computer equipment to solve the problem that the existing cooling device for computer equipment proposed in the background art has relatively single functions and poor heat dissipation performance, and the sound insulation performance at the position of the built-in cooling fan is also solved. Poor, problems that affect user experience
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[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0027] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.
[0028] refer to Figure ...
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The invention discloses a heat dissipation device for computer equipment. The head dissipation device comprises a computer case body; a heat dissipation support base is fixedly installed at the bottomof the computer case body through an assembling mechanism. The assembly mechanism comprises disassembly and assembly protection plates which are symmetrically mounted on two sides of the heat dissipation bracket base; a connecting guide rod is fixedly installed on the side, corresponding to the side close to the heat dissipation support base, of the disassembly and assembly protection plate. A handle groove is fixedly formed in one side, correspondingly far away from the heat dissipation bracket base, of the disassembly and assembly protection plate; an assembling mechanism is designed and installed at the connecting position of a computer case body and a heat dissipation support base, rapid mounting and fixing of the computer case body and the heat dissipation support base are achieved,the use convenience of the device is greatly improved, and meanwhile the stability of the heat dissipation device for the computer equipment in the use process is greatly guaranteed through clamping and fixing of the fixing insertion blocks and the fixing holes in the limiting sleeves.
Description
technical field [0001] The invention belongs to the technical field of heat dissipation devices, and in particular relates to a heat dissipation device for computer equipment. Background technique [0002] A computer, commonly known as a computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logical calculations, and has storage and memory functions. It is a modern intelligent electronic device that can run according to the program and process massive data automatically and at high speed. [0003] Existing cooling devices for computer equipment have poor heat dissipation performance at the position of the built-in case, and the side walls or top of the general case are often provided with holes for heat dissipation. The opening of such holes will greatly reduce the heat dissipation of the device. Waterproof performance has a great potential safety hazard. At the same time, the general heat dissipation mechani...
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IPC IPC(8): G06F1/20G06F1/18B01D46/00
CPCG06F1/183G06F1/20B01D46/00
Inventor 陈子夜
Owner 安徽海佩电子科技有限公司