Compound bulging-and-correcting integration device for ultrathin sheet microstructure
A microstructure, integrated technology, applied in the direction of metal processing equipment, forming tools, manufacturing tools, etc., can solve the problems of poor plastic forming ability, thin wall thickness, and easy warpage
Inactive Publication Date: 2020-07-31
SUZHOU UNIV
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Problems solved by technology
However, ultra-thin materials such as pure titanium have poor plastic forming ability, and the wall thickness is seriously thinned or even cracked during microstructure forming, which seriously reduces the corrosion resistance and service life of the material.
At the same time, large-area ultra-thin-walled microstructure parts are prone to defects such as warpage and poor microstructure uniformity.
Method used
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[0022] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0023] See figure 1 and figure 2 , the ultra-thin plate microstructure 4 forming device in a preferred embodiment of the present invention is connected with an external driving device, which can be a servo punching machine, which provides precise up and down movement, and the displacement accuracy is less than 3 μm, and has Good guiding accuracy. The ultra-thin plate microstructure 4 forming device includes a first mold base 1, several guide pillars 3 arranged on the first mold base 1, and connected with the guide pillars 3 and connected with the first mold base 1. The second mold base 2 is oppositely arranged. The external driving device can drive the second mold base...
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The invention relates to a compound bulging-and-correcting integration device for an ultrathin sheet microstructure. The compound bulging-and-correcting integration device is connected with an external driving device and comprises a first mould base, several guide pillars arranged on the first mould base and a second mould base which is connected with the guide pillars and is opposite to the firstmould base, wherein the external driving device can drive the second mould base to move towards the first mould base along the guide pillars, and an accommodating space is formed between the first mould base and the second mould base. The compound bulging-and-correcting integration device for the ultrathin sheet microstructure furthermore comprises a first bulging assembly, a second bulging assembly and a correcting assembly, wherein the first bulging assembly, the second bulging assembly and the correcting assembly are arranged in the accommodating space to make to-be-formed target pieces bulge, the to-be-formed target pieces are driven by the external driving device to sequentially pass through the first bulging assembly, the second bulging assembly and the correcting assembly to obtaina finished product. By means of the compound bulging-and-correcting integration device, correcting, punching and blanking of the ultrathin sheet microstructure can be achieved simply through one mould, and the integration device is convenient to use.
Description
technical field [0001] The invention relates to an ultra-thin plate microstructure composite bulging and shape-correcting integrated device, which belongs to the technical field of ultra-thin plate forming and manufacturing. Background technique [0002] The wall thickness is 30-150μm, and the microstructure groove width is 0.5-1.5mm. Metal ultra-thin-walled microstructures are widely used in fuel cells and other fields. They have multiple functions such as mass transfer, heat transfer, current collection and support. The output power and specific power density have an important influence. In order to meet the needs of commercial applications, higher requirements are put forward for the volume, weight and corrosion resistance of ultra-thin-walled microstructures. However, the existing materials and forming manufacturing technology cannot meet the application requirements in terms of weight and corrosion resistance. Recently, metal ultra-thin-walled materials with good corr...
Claims
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IPC IPC(8): B21D37/08B21D35/00
CPCB21D35/002B21D37/08
Inventor 王春举程利冬贺海东董善亮孙立宁
Owner SUZHOU UNIV