Compound bulging-and-correcting integration device for ultrathin sheet microstructure

Abstract

The invention relates to a compound bulging-and-correcting integration device for an ultrathin sheet microstructure. The compound bulging-and-correcting integration device is connected with an external driving device and comprises a first mould base, several guide pillars arranged on the first mould base and a second mould base which is connected with the guide pillars and is opposite to the firstmould base, wherein the external driving device can drive the second mould base to move towards the first mould base along the guide pillars, and an accommodating space is formed between the first mould base and the second mould base. The compound bulging-and-correcting integration device for the ultrathin sheet microstructure furthermore comprises a first bulging assembly, a second bulging assembly and a correcting assembly, wherein the first bulging assembly, the second bulging assembly and the correcting assembly are arranged in the accommodating space to make to-be-formed target pieces bulge, the to-be-formed target pieces are driven by the external driving device to sequentially pass through the first bulging assembly, the second bulging assembly and the correcting assembly to obtaina finished product. By means of the compound bulging-and-correcting integration device, correcting, punching and blanking of the ultrathin sheet microstructure can be achieved simply through one mould, and the integration device is convenient to use.

Description

technical field [0001] The invention relates to an ultra-thin plate microstructure composite bulging and shape-correcting integrated device, which belongs to the technical field of ultra-thin plate forming and manufacturing. Background technique [0002] The wall thickness is 30-150μm, and the microstructure groove width is 0.5-1.5mm. Metal ultra-thin-walled microstructures are widely used in fuel cells and other fields. They have multiple functions such as mass transfer, heat transfer, current collection and support. The output power and specific power density have an important influence. In order to meet the needs of commercial applications, higher requirements are put forward for the volume, weight and corrosion resistance of ultra-thin-walled microstructures. However, the existing materials and forming manufacturing technology cannot meet the application requirements in terms of weight and corrosion resistance. Recently, metal ultra-thin-walled materials with good corr...

AI Technical Summary

Problems solved by technology

However, ultra-thin materials such as pure titanium have poor plastic forming ability, and the wall thickness is seriously thinned or even cracked during microstructure forming, which seriously reduces the corrosion resistance and service life of the material.

At the same time, large-area ultra-thin-walled microstructure parts are prone to defects such as warpage and poor microstructure uniformity.

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