CQFP (Ceramic Quad Flat Package) lead four-side forming and cutting device

Abstract

The invention discloses a CQFP (Ceramic Quad Flat Package) lead four-side forming and cutting device, which comprises a base, a punching lower die device, a punching upper die device, a two-dimensional size regulation device, a station height regulation device and a control device, wherein the punching lower die device is used for punching the lower surface of a CQFP device lead; the punching upper die device is used for punching the upper surface of the CQFP device lead; the two-dimensional size regulation device is used for simultaneously regulating the two-dimensional sizes of the punchinglower die device and the punching upper die device; the punching upper die device is provided with a cutting foot mould used for shearing the unnecessary lead of the CQFP device; the two-dimensional size regulation device, the station height regulation device and the punching upper die device are all connected with the control device; and the control device is used for controlling the two-dimensional size regulation device and the station height regulation device to move, and is used for controlling the punching upper die device to vertically move to finish a lead punching formation operationand a cutting operation of the unnecessary lead. According to the device, the one-time forming and cutting of the four-side lead of the straight-lead CQFP can be realized, and formation efficiency andlead coplanarity are effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of micro-assembly and electronic assembly, more specifically, to a four-sided forming and cutting device for CQFP leads. Background technique [0002] At present, most military or aerospace-grade CQFP devices leave the factory with leads parallel to the upper / lower surfaces of the device body. Adjust the pad package of the corresponding device. However, this type of straight leads parallel to the upper / lower surface of the device body cannot be directly soldered, and it needs to be shaped in advance so that the height of the device from the board (device stand height), the length of the lead bending point from the device body ( Lead shoulder width) and the length of the lead and the printed board pad lap (soldering surface length) match the printed board pad package. [0003] In the prior art, there are mainly three types of forming devices for such straight lead CQFP packaged devices: [0004] The first ...

AI Technical Summary

Problems solved by technology

Using this forming equipment to form the leads of CQFP requires four clamping and forming station adjustments, resulting in low forming efficiency

At the same time, due to the dimensional error introduced every time the fixture is installed, the coplanarity deviation after the four-sided leads are formed makes subsequent welding difficult and introduces potential reliability hazards

[0005] The second is the double-sided forming equipment, which can realize the one-time forming and cutting of the leads on the opposite sides. Compared with the single-side adjustable double-station forming equipment, its forming efficiency has been greatly improved, but it needs a second clamping to complete the other two sides. The forming and cutting operation of the lead wire and the secondary clamping not only require high technical ability of the personnel and the operation process, but the careless operation can easily cause the deformation of the formed lead wire, resulting in the failure of the lead wire forming, and to a certain extent, the common lead wire will still be introduced. Face problems

[0006] The third is a fixed-size CQFP fixed forming device, which can further improve forming efficiency and ensure pin coplanarity, but this forming device cannot be adjusted in size, and can only meet CQFP lead forming with specific package size and specific pad parameters operate

The size of the fixed forming device needs to be adjusted if the pad parameters change or the size of the CQFP package changes. It is difficult to design and process, and it will also increase the manufacturing cost of the forming equipment.

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