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Terminal for socket, socket, and electronic device

A technology of terminals and sockets, which is applied in the field of sockets of integrated circuits arranged in a ball matrix, and can solve the problems of increased socket costs, difficult maintenance, high maintenance costs, etc.

Active Publication Date: 2020-08-07
HYGON INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the existing ball grid array integrated circuit is installed on the printed circuit board, it will face subsequent maintenance difficulties, high maintenance costs or the use of expensive sockets to increase the cost.

Method used

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  • Terminal for socket, socket, and electronic device
  • Terminal for socket, socket, and electronic device
  • Terminal for socket, socket, and electronic device

Examples

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Embodiment Construction

[0053] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0054] It should be noted that like numerals and let...

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PUM

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Abstract

The invention provides a terminal for a socket, the socket which comprises the terminal and is used for connecting an integrated circuit and a mainboard, and an electronic device. A spherical matrix arrangement integrated circuit is fixed on the mainboard through the socket, the terminal comprises an arc-shaped integrated structure, and the top and the bottom of the arc-shaped integrated structurecomprise convex structures, the socket is provided with a terminal hole site and a ball hole site, the terminal is arranged in the terminal hole site and is fixed, the upper part and the lower part of the terminal can move up and down along the terminal hole site, and a solder ball of the integrated circuit can be placed in the ball hole site; the socket further comprises a shell which can support an integrated circuit substrate. A combination end of the terminal of the socket structure device and a bonding pad of the mainboard can be a solder ball or an elastic contact. The sliding thrust directions of integrated circuit terminals are in same direction, grouping balance facing or grouping balance opposite arrangement.

Description

technical field [0001] The invention relates to a socket terminal, a socket structure and an electronic device with the socket structure, more specifically, to a socket for ball matrix array integrated circuits, and the socket is used to connect the integrated circuits and the main board. Background technique [0002] A ball grid array (BGA) integrated circuit consists of an integrated circuit chip mounted within a plastic or ceramic substrate and has solder balls arranged in an array across the bottom surface of the substrate. When the existing ball grid array integrated circuit is installed on the printed circuit main board, it will face difficulties in follow-up maintenance, high maintenance cost or the use of expensive sockets to increase the cost. [0003] Therefore, aiming at the deficiencies in the prior art, a low-cost socket terminal suitable for ball grid matrix array integrated circuits is proposed, and the socket structure is designed based on this terminal to ob...

Claims

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Application Information

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IPC IPC(8): H01R12/71H01R13/24H01R13/03
CPCH01R12/714H01R13/2485H01R13/03
Inventor 杨晓君柳胜杰钱晓峰程鹏刘新春
Owner HYGON INFORMATION TECH CO LTD