A method of manufacturing a display device
A technology of display device and display area, applied in the direction of identification device, instrument, etc., can solve the problems of drop, electrical connection failure, deformation of bending place, etc., to reduce the probability of drop, improve reliability, and reduce offset. effect of chance
Active Publication Date: 2022-06-21
厦门通富微电子有限公司
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Problems solved by technology
However, when the bendable substrate is bent, deformation occurs at the bend, and the accumulated stress may cause the chip electrically connected to the surface of the substrate to shift or even fall off on the substrate, thereby causing damage inside the display device. The reliability of the electrical connection is reduced or even the electrical connection fails
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[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.
[0045] see figure 1 ,figure 1 It is a schematic flowchart of an embodiment of a method for preparing a display device of the present application, and the method includes the following steps:
[0046] S11, at least one groove is formed on a side surface of the substrate located in the non-display area, and at least one first metal bump is arranged in the groove, and the first metal bump is electrically connected to a circuit in the s...
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The application discloses a method for preparing a display device, which belongs to the field of display technology. The manufacturing method of the display device disclosed in the present application first forms at least one groove on one side surface of the substrate located in the non-display area, and at least one first metal bump is arranged in the groove, and the first metal bump is connected to the substrate. The circuit exposed from the groove is electrically connected; the first metal bump is directly electrically connected to the second metal bump on the functional surface of the chip by thermocompression bonding. The grooves on the above-mentioned substrate can limit the position of the chip, reduce the probability of the chip shifting during the bending process with the bendable substrate, and reduce the probability of the chip falling, thereby improving the relationship between the chip and the chip. The reliability of the substrate electrical connection.
Description
technical field [0001] The present application relates to the field of display technology, and in particular, to a preparation method of a display device. Background technique [0002] When the display device product is assembled, the surface of the bendable substrate is flat, and the surface of the substrate in the non-display area is provided with an exposed circuit for electrical connection with the chip. Usually, the functional surface of the chip needs to be electrically connected to the circuit exposed on the surface of the bendable substrate, and then the bendable substrate is bent. However, when the bendable substrate is bent, deformation occurs at the bend, and stress accumulates, which may cause the chips electrically connected to the surface of the substrate to shift on the substrate, or even fall off, thereby causing internal damage to the display device. The reliability of the electrical connection is reduced or even the electrical connection fails. SUMMARY O...
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IPC IPC(8): G09F9/30
CPCG09F9/30
Inventor 李骏戴颖
Owner 厦门通富微电子有限公司