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electronic components

A technology of electronic components and components, which is applied in the direction of fixed capacitor components, electrical components, circuits, etc.

Active Publication Date: 2022-01-11
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

resin tends to absorb moisture

Method used

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Embodiment Construction

[0059] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same elements or elements having the same function are denoted by the same reference numerals, and repeated explanations are omitted.

[0060] will refer to Figure 1 to Figure 10 The configuration of the multilayer capacitor C1 according to the embodiment will be described. figure 1 is a perspective view of a multilayer capacitor according to an embodiment. figure 2 is a side view of the multilayer capacitor according to the embodiment. Figure 3 to Figure 5 is a view showing a cross-sectional configuration of a multilayer capacitor according to an embodiment. Image 6 with Figure 7 is a view showing a cross-sectional structure of an external electrode. Figure 8 is a plan view showing the element main body, the first electrode layer, and the second electrode layer. Figure 9 is a side view showing the elem...

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Abstract

An electronic component of the present invention includes an element main body having a plurality of side surfaces adjacent to each other and external electrodes provided on the plurality of side surfaces. The external electrode includes a conductive resin layer with a plurality of gaps and a plating layer provided on the conductive resin layer. Between the edge of the plating and the element body there is a void communicating with the plurality of gaps. The conductive resin layer includes a first portion on one of the plurality of sides and a second portion on the other of the plurality of sides. The presence ratio of gaps in the first portion is greater than the presence ratio of gaps in the second portion.

Description

technical field [0001] The present invention relates to an electronic component. Background technique [0002] A known electronic component includes an element body and external electrodes provided on the element body (refer to, for example, Japanese Unexamined Patent Publication No. H05-144665). The element body includes a plurality of surfaces adjacent to each other. External electrodes are disposed on multiple surfaces. The external electrodes include a conductive resin layer and a plating layer provided on the conductive resin layer. Contents of the invention [0003] A conductive resin layer is generally formed on a substrate and contains resin and conductive metal particles. The substrate comprises, for example, a sintered metal layer or a component body. Resin tends to absorb moisture. In the case of soldering and mounting electronic parts on electronic equipment, moisture absorbed by the resin may be vaporized, and volume expansion may occur. In this case, st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/30H01G4/232H01G4/12
CPCH01G4/30H01G4/232H01G4/2325H01G4/12H01G4/1227H01G4/012H01G4/248
Inventor 小野寺伸也田村健寿森田健
Owner TDK CORPARATION