A kind of component encapsulation comparison method and relative device

Abstract

The embodiment of the present application provides a component package comparison method and a related device. For the first component package and the second component package, since the first component package and the second component package use the same package template, the first component package Same dimensions as the second component package. Based on this, the first component package and the second component package can be aligned by selecting a point on the package template as a comparison reference point for the first component package and the second component package. Since the comparison reference point is equivalent to the standard for comparing the first component package and the second component package, the first package information of the first component package and the second package information corresponding to the second component package can be determined based on the position of the relative comparison reference point, The difference package information is generated by comparing the first package information and the second package information, which realizes the automatic comparison of the first component package and the second component package, and improves the comparison efficiency of component packages.

Description

technical field [0001] The present application relates to the technical field of printed electronic circuits, in particular to a component packaging comparison method and a related device. Background technique [0002] During the research and development process of a printed circuit board (Printed Circuit Board, PCB), it is necessary to constantly modify the design of the component package (footprint) to meet the needs of customers. Regardless of whether it is a server motherboard or a small board, there is a situation where the customer provides a reference version, and the customer hopes that part of the footprint on the designed PCB is the same as the footprint on the reference version. In order to meet the needs of customers, engineers usually change the design on the basis of the original PCB. However, to make changes to the original PCB, it is necessary to know the difference between the footprint in the existing factory component library and the reference footprint p...

AI Technical Summary

Problems solved by technology

However, to make changes to the original PCB, it is necessary to know the difference between the footprint in the existing factory component library and the reference footprint provided by the client. Therefore, the engineer needs to manually compare the footprints on the two PCBs.

However, a large footprint may have hundreds of pins (PIN) or even thousands of PINs. Manually comparing two footprints is time-consuming and labor-intensive, and the work efficiency is low.

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