A low-temperature ceramic bond for diamond abrasive tools used for optical fiber ferrules and its preparation method
A ceramic bond and optical fiber ferrule technology, which is applied in metal processing equipment, abrasives, manufacturing tools, etc., can solve the problems of low tensile strength, low processing efficiency, and high sharpness, so as to reduce sintering temperature, improve processing efficiency and The effect of machining accuracy
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0017] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 65.5 parts, Al 2 O 3 5 parts, 13.5 parts boric acid, Na 2 CO 3 4 parts, CaO 5 parts, ZnO 3 parts, Li 2 CO 3 2 servings, Ba 2 CO 3 3 parts, 4 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 1 serving;
[0018] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.
[0019] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furnace, and co...
Embodiment 2
[0022] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 64 servings, Al 2 O 3 5 parts, 12.5 parts boric acid, Na 2 CO 3 4.5 parts, CaO 3.5 parts, ZnO 2.5 parts, Li 2 CO 3 3 servings, Ba 2 CO 3 3.5 parts, 5 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 2 servings;
[0023] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.
[0024] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furna...
Embodiment 3
[0027] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 65 servings, Al 2 O 3 5.5 parts, 14 parts boric acid, Na 2 CO 3 5 parts, CaO 3 parts, ZnO 2 parts, Li 2 CO 3 2.5 servings, Ba 2 CO 3 2.5 parts, 3.5 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 5 servings;
[0028] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.
[0029] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low-temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furnace...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| flexural strength | aaaaa | aaaaa |
| microhardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More