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A low-temperature ceramic bond for diamond abrasive tools used for optical fiber ferrules and its preparation method

A ceramic bond and optical fiber ferrule technology, which is applied in metal processing equipment, abrasives, manufacturing tools, etc., can solve the problems of low tensile strength, low processing efficiency, and high sharpness, so as to reduce sintering temperature, improve processing efficiency and The effect of machining accuracy

Active Publication Date: 2022-03-25
郑州力弘超硬材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The fiber optic ferrule is made of zirconia ceramic material, which has the common characteristics of functional ceramics and engineering ceramics, high shear stress resistance and low tensile strength, large elastic modulus and high brittleness. The slight vibration in the process directly affects its dimensional accuracy; at present, the optical fiber ferrule is processed by diamond grinding wheel. However, the existing diamond grinding wheel has low strength and high sharpness, and the shape retention performance of the optical fiber ferrule is poor. , the yield rate is low, the compensation amount of the grinding machine per unit time is large, and the finished products processed by a single diamond grinding tool are less; The rate is low, and the processing efficiency of the fiber optic ferrule is low
In general, problems such as low surface roughness, brittle fracture, and low processing efficiency of ceramics are prone to occur.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 65.5 parts, Al 2 O 3 5 parts, 13.5 parts boric acid, Na 2 CO 3 4 parts, CaO 5 parts, ZnO 3 parts, Li 2 CO 3 2 servings, Ba 2 CO 3 3 parts, 4 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 1 serving;

[0018] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.

[0019] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furnace, and co...

Embodiment 2

[0022] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 64 servings, Al 2 O 3 5 parts, 12.5 parts boric acid, Na 2 CO 3 4.5 parts, CaO 3.5 parts, ZnO 2.5 parts, Li 2 CO 3 3 servings, Ba 2 CO 3 3.5 parts, 5 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 2 servings;

[0023] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.

[0024] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furna...

Embodiment 3

[0027] The low-temperature ceramic bond for diamond abrasive tools used for optical fiber pins in this embodiment is specifically composed of the following components in mass fractions: SiO 2 65 servings, Al 2 O 3 5.5 parts, 14 parts boric acid, Na 2 CO 3 5 parts, CaO 3 parts, ZnO 2 parts, Li 2 CO 3 2.5 servings, Ba 2 CO 3 2.5 parts, 3.5 parts MgO, nano-ZrO with particle size of 14nm-50nm 2 5 servings;

[0028] The above substances are weighed according to the mass fraction, mixed in a ball mill for 4 hours, fully melted in a frit furnace at 1450°C, quenched by water, dried and ball-milled for 24 hours and then passed through a 300-mesh screen to obtain a diamond mill for optical fiber pins. With low temperature ceramic bond.

[0029] Preparation of diamond abrasive tools: 100 parts of diamond micropowder, 28.5 parts of low-temperature ceramic bond, 6 parts of green silicon carbide micropowder, 3 parts of dextrin powder, sintered at 750 degrees in a resistance furnace...

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Abstract

The invention discloses a special diamond abrasive tool ceramic bond for processing optical fiber ferrules and a preparation method thereof. The ceramic bond is composed of the following mass fraction components: SiO 2 60-70 parts, Al 2 o 3 1-6 parts, 10-15 parts of boric acid, Na 2 CO 3 1~5 parts, ZnO 1~5 parts, Li 2 CO 3 1 to 3 parts, Ba 2 CO 3 1~5 parts, CaO 2~7 parts, MgO 1~5 parts, nano‑ZrO 2 1 to 10 servings. Adding nano‑ZrO to Low Temperature Vitrified Bonds 2 Not only can the sintering temperature of the vitrified bond be significantly reduced, but also the compactness and toughness can be improved; the diamond abrasive tool made based on the vitrified bond has suitable strength and toughness, and the optical fiber ferrule processed under the same conditions has a high finish. Large quantity, high yield, suitable for high-efficiency, high-speed, high-precision grinding of hard and brittle materials such as optical fiber ferrules.

Description

technical field [0001] The invention belongs to the technical field of a diamond abrasive tool ceramic bond, in particular to a diamond abrasive tool low-temperature ceramic bond used for optical fiber pins and a preparation method thereof. Background technique [0002] Optical fiber ferrule is an important connection device for coupling two optical fibers. It is of great significance to the accuracy of optical fiber connection. It requires extremely high dimensional accuracy and processing stability. The higher the accuracy, the smaller the optical dielectric loss during the optical fiber transmission process. With the rapid development of optical communication technology, the requirements for optical fiber communication technology are getting higher and higher, and the performance requirements for optical fiber communication interface pins are also getting higher and higher. The machining accuracy of inner hole and coaxiality should be guaranteed within 1um, and the surface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/14
CPCB24D3/14
Inventor 田久根侯永改刘方晓
Owner 郑州力弘超硬材料有限公司