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Electronic equipment and connection method of FPC and circuit board

A technology of electronic equipment and connection method, which is applied in the structural connection of printed circuits, electrical connection of printed components, printed circuits, etc., can solve the problems of poor reliability and high cost of connection between FPC and circuit boards, and achieve improved stability and reliability. Reduced assembly steps and cost reduction effects

Active Publication Date: 2020-08-18
SHANGHAI CHUANGGONG COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a method for connecting an electronic device and an FPC to a circuit board in order to overcome the defects of poor reliability and high cost of the connection between the FPC and the circuit board in the prior art

Method used

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  • Electronic equipment and connection method of FPC and circuit board
  • Electronic equipment and connection method of FPC and circuit board
  • Electronic equipment and connection method of FPC and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides an electronic device, such as figure 1 As shown, the housing of the electronic device is provided with an FPC2 and a circuit board 3, and the housing includes a first housing 1;

[0050] The pad of FPC2 is aligned with the pad of circuit board 3; the pad of FPC2 and the pad of circuit board 3 are covered with solder 5;

[0051] A magnetic conduction heating unit 4 is arranged between the FPC2 and the first housing 1 . The magnetic conduction heating unit 4 is arranged on the back of the FPC2 and presses the FPC2 so that the pads of the FPC2 and the pads of the circuit board 3 are in close contact. The magnetic conduction heating unit 4 is used for inducing an external alternating magnetic field to generate heat, thereby melting the solder 5 on the pads of the FPC2 and the pads of the circuit board 3 to realize the connection between the FPC2 and the circuit board 3 .

[0052] The electronic equipment of this embodiment uses such as figure 2 T...

Embodiment 2

[0058] On the basis of Embodiment 1, this embodiment provides an electronic device. Such as Figure 4 As shown, a foam glue 6 is arranged between the first housing 1 of the electronic device and the magnetic conduction heating unit 4;

[0059] The foam glue 6 is used to cover the magnetic conduction heating unit 4 .

[0060] During welding, the foam glue 6 is used for pre-compression by the foam glue 6 when the pressure head at the bottom of the external isolated welding device is pressed on the first housing 1, so as to ensure the pads of the FPC2 and the circuit board 3 Adhere evenly and fully.

[0061] The housing of the electronic device also includes a second casing 7 on which the circuit board 3 is fixedly arranged, and the first casing 1 is installed on the second casing 7 to realize the complete assembly of the electronic device.

[0062] The first casing 1 of the electronic device is fixedly provided with a brace 8; the supporting surface of the brace 8 is covered ...

Embodiment 3

[0076] This embodiment provides a method for connecting an FPC to a circuit board, such as Image 6 As shown, the connection method between the FPC and the circuit board includes the following steps:

[0077] S200. Align the pads of the FPC with the pads of the circuit board;

[0078] S300, pressing the magnetic conduction heating unit against the FPC;

[0079] S500, the magnetic conduction heating unit induces an external alternating magnetic field to generate heat, so that the solder of the pads of the FPC and the pads of the circuit board melts to realize the connection between the FPC and the circuit board.

[0080] The FPC and the circuit board of the present embodiment are arranged in the electronic equipment, and the electronic equipment uses such as figure 2 The isolated soldering setup shown performs isolated soldering.

[0081] In the connection method between the FPC and the circuit board of this embodiment, when performing isolation welding, after the pads of t...

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Abstract

The invention discloses electronic equipment and a connection method of an FPC and a circuit board, wherein the FPC and the circuit board are arranged in a shell of the electronic equipment, and the shell comprises a first shell; a bonding pad of the FPC is aligned with a bonding pad of the circuit board; and a magnetic conductive heating unit is arranged between the FPC and the first shell, compresses the FPC and is used for sensing an external alternating magnetic field to generate heat, so soldering tin of a bonding pad of the FPC and soldering tin of a bonding pad of the circuit board aremelted to realize connection between the FPC and the circuit board. The external isolation type welding device is used for generating an alternating magnetic field, so the magnetic conduction heatingunit generates heat; the soldering tin on the bonding pad of the FPC is melted to realize the connection between the FPC and the circuit board, and the welding is carried out after the shell is assembled, so the stability and reliability of the connection between the FPC and the circuit board are improved, the assembling steps are reduced, and the cost is reduced.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to an electronic equipment and a connection method between an FPC and a circuit board. Background technique [0002] At present, the fingerprint FPC (flexible circuit board), wireless charging FPC and NFC-FPC (near field communication-flexible circuit board) on the back shell of electronic products such as mobile phones and tablets are mainly connected to the circuit board in the following two ways: 1) use The shrapnel is connected to fix the FPC to the rear shell, and the gold finger is exposed on the surface, and the shrapnel on the circuit board and the positive pressure of the gold finger are used to form conduction. In this connection method, the length of the FPC is relatively small, and the assembly is simple. However, due to the deformation of the rear shell during the drop test, the contact reliability between the shrapnel and the gold finger is not good. Therefore, this...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/14
CPCH05K1/115H05K1/117H05K1/118H05K1/147
Inventor 罗振宇
Owner SHANGHAI CHUANGGONG COMM TECH