Glue curing and baking device and method for SMD

Abstract

The invention discloses a glue curing and baking device for SMD. The device comprises a baking box and SMD electronic elements, wherein a conveying pump is installed on the outer wall of the baking box, the input end of the conveying pump is connected with a feeding pipe, the output end of the conveying pump is connected with a communicating pipe, and the discharging end of the communicating pipeextends into the baking box and is connected with a flow dividing plate; a bottom plate is arranged on the lower portion of the interior of the baking box, a rotating mechanism is installed on the bottom plate, the output end of the rotating mechanism is connected with an installation cylinder, and multiple sets of fixing plates are evenly arranged on the outer wall of the installation cylinder; and second motors are mounted in the fixing plates, the output ends of the second motors are connected with mounting plates, the mounting plates are located on the top surfaces of the fixing plates, mounting blocks are arranged on the top surfaces of the mounting plates, the mounting blocks are square blocks, and the side walls of the mounting plates are connected with the SMD electronic elements through clamping mechanisms. According to the device, multiple groups of SMD electronic elements can be baked at the same time, so that the glue fixing efficiency of the SMD electronic elements is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of SMD production, and relates to a glue curing and baking device and method, in particular to a glue curing and baking device and method for SMD. Background technique [0002] SMD: It is the abbreviation of Surface Mounted Devices, which means: surface mount device, which is one of the SMT (Surface Mount Technology) components. In the initial stage of electronic circuit board production, via assembly is completely done manually. When the first automated machines came out, they could place some simple leaded components, but complex components still required manual placement for reflow soldering. Surface Mounted components mainly include rectangular chip components, cylindrical chip components, composite chip components, and special-shaped chip components. [0003] However, in the prior art, in the process of baking SMD electronic components, the number of SMD electronic components is usually limited, and i...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem in the prior art that in the process of baking SMD electronic components, the number of SMD electronic components is usually limited, and it is impossible to bake a large number of SMD electronic components at one time. The efficiency of baking is relatively low, and it is impossible to bake many groups of SMD electronic components at the same time, and ensure the quality of the glue curing; SMD electronic components need to be clamped and fixed during the painting process of SMD electronic components. Some clamping and fixing devices are not convenient enough to use, and a glue curing and baking device and method for SMD is proposed

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