Preparation method of diamond wire cutting pulley piece

Abstract

The invention discloses a preparation method of a diamond wire cutting pulley piece. The preparation method comprises the steps of bar cutting, general lathing and hole forming, rough machining, material heating, hot sleeving, obtaining of a semi-finished product, numerically controlled slotting and obtaining of a finished product, wherein: (1) firstly, a polyethylene bar is cut in sections, the outer circle is turned, and the inner circle is bored, so as to obtain a polyethylene ring; (2) the obtained polyethylene ring is softened and expanded in the form of oven heating; (3) a softened and expanded polyethylene ring is installed on a nylon frame, and after natural cooling, the polyethylene ring condenses, shrinks and is in interference fit with the nylon frame to form a semi-finished pulley piece; and (4) a CNC lathe is used to remove margins on both sides and on the outer circle of the polyethylene semi-finished product, and then the finished product is obtained after the surface ofthe semi-finished product is slotted through the movement of a slotting tool along the X---Z axis. The prepared pulley effectively reduces the proportion of wire breakage caused by the winding and unwinding of a diamond wire during the silicon wafer cutting process, reduces the cutting loss of the diamond wire, prolongs the service life of the pulley, improves the yield of cutting products, and improves the efficiency of man-machine cutting.

Description

technical field [0001] The invention relates to a preparation method of a diamond wire cutting pulley sheet, which is applied in the field of multi-wire cutting of silicon wafers. Background technique [0002] At present, due to the advantages of economical and environmental protection, high cutting effect, and low fragmentation rate of the cut silicon wafers in the subsequent battery manufacturing process, diamond wire cutting technology has been widely valued by the photovoltaic industry. With the development of diamond wire cutting technology, its advantages Obviously, it will gradually replace the traditional mortar multi-wire cutting technology in the future and become the mainstream technology for silicon wafer cutting, so the demand for diamond wire cutting machines is increasing; [0003] Since the main body of diamond wire cutting is diamond wire, the silicon wafer is cut by the diamond wire. Therefore, a plurality of pulleys for supporting or correcting the diamond...

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Problems solved by technology

[0003] Since the main body of diamond wire cutting is diamond wire, the silicon wafer is cut by the diamond wire. Therefore, a plurality of pulleys for supporting or correcting the diamond wire are fixed on the diamond wire cutting machine. However, at present, silicon wafer cutting Due to the influence of pulleys in the process, the proportion of broken wires is high, the cutting loss of steel wires is large, and the service life of pulleys is short. The problem of poor efficiency

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