Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic circuit

A technology for electronic circuits and printed wiring substrates, which is applied in the directions of printed circuits, printed circuits, and assembling printed circuits with electrical components, which can solve problems such as rising manufacturing costs of electronic circuits.

Active Publication Date: 2020-09-11
DENSO CORP +1
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there is a possibility that the manufacturing cost of the electronic circuit increases and the size of the electronic circuit increases.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic circuit
  • Electronic circuit
  • Electronic circuit

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0026] [1-1. Overall structure]

[0027] Such as figure 1 As shown, the antenna unit 1 in the first embodiment is a vehicle-mounted antenna unit, and includes a substantially rectangular parallelepiped housing 2 , and two connectors 3 and 5 are exposed from one side of the housing 2 . Such as figure 2 As shown, these two connectors 3 and 5 are surface-mounted (hereinafter, mounted) on a main substrate 9 by reflow soldering together with an IC chip 7 for performing various processes, and housed in a case 2 . In addition, six printed wiring boards 10 , 20 , 30 , 40 , 50 , and 60 , which are smaller than the printed wiring boards constituting the main board 9 , are mounted on the main board 9 by reflow soldering.

[0028] Furthermore, the main board 9 , the two connectors 3 and 5 mounted on the main board 9 , the IC chip 7 , and the six printed wiring boards 10 to 60 constitute an electronic circuit 80 as the first embodiment. In addition, in the following, the positional rel...

no. 2 approach

[0056] [2-1. Differences from the First Embodiment]

[0057] Since the second embodiment has the same basic configuration as that of the first embodiment, the description of the common configuration will be omitted, and the description will focus on the differences. The electronic circuit of the second embodiment is equipped with such Figure 9 The illustrated board pair including the printed wiring board 210 serving as the antenna board differs in points.

[0058] Such as Figure 9 As shown, printed wiring board 210 configured in a rectangular plate shape is mounted such that edge 210A corresponding to one long side of the rectangle abuts against component mounting surface 9A. Three protrusions 211 , 212 , and 213 protruding in the −Z direction are provided on the edge 210A. The protrusion 211 is configured to function as an electrode for feeding power to the antenna pattern 214 formed on the printed circuit board 210 . In addition, the protrusion 212 and the protrusion 2...

no. 3 approach

[0065] [3-1. Differences from the First Embodiment]

[0066] Since the third embodiment has the same basic configuration as that of the first embodiment, the description of the common configuration will be omitted, and the description will focus on different points. In the first embodiment, two rectangular through-holes 18 and 19 are formed in a line along the ±Z direction on the printed wiring board 10 serving as the antenna board. For this, the electronic circuit of the third embodiment is equipped with such Figure 10 The illustrated board pair including the printed wiring board 310 serving as the antenna board differs in points.

[0067] Such as Figure 10 As shown, the rectangular plate-shaped printed wiring board 310 is mounted such that an edge 310A corresponding to one long side of the rectangle abuts on the component mounting surface 9A. The edge 310A may be arranged in any direction on the component mounting surface 9A. However, similar to the printed circuit boar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This electronic circuit comprises: a first printed wiring board (9); second printed wiring boards (10, 30, 50); and third printed wiring boards (20, 40, 60). The second printed wiring boards are mounted so that one edge (10A, 30A, 50A) thereof abuts a part mounting surface (9A) of the first printed wiring board, i.e. abuts a surface of the first printed wiring board on which parts (3, 5, 7) are mounted. The third printed wiring boards are mounted so that one edge (20A, 40A, 60A) thereof abuts the part mounting surface. The second printed wiring boards and the third printed wiring boards are connected to each other in a state in which the board thickness direction of the second printed wiring boards is oriented in a different direction, around a normal line rising from the part mounting surface, from that of the third printed wiring boards. Further, an antenna pattern is formed on the second printed wiring boards and / or the third printed wiring boards.

Description

[0001] Cross References to Related Applications [0002] This international application claims priority based on Japanese Patent Application No. 2018-015601 filed with the Japan Patent Office on January 31, 2018, and the entire contents of Japanese Patent Application No. 2018-015601 are incorporated by reference into this international application. technical field [0003] The present disclosure relates to electronic circuits provided with antenna patterns. Background technique [0004] Conventionally, for example, electronic equipment such as a telematics wireless equipment (hereinafter, TCU) has a built-in electronic circuit including an antenna. As such an antenna structure, various structures have been proposed besides a structure in which an antenna pattern is formed on a main substrate of an electronic circuit (for example, a printed wiring board on which an IC chip or the like is mounted). Specifically, a structure in which an antenna pattern is formed on a rigid sub...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H01Q1/12H01Q1/38H04M1/02H05K1/02H05K3/36
CPCH01Q1/12H01Q9/42H05K2201/10098H05K3/366H05K2201/047H05K1/141H05K2201/048H05K2201/09081H01Q1/36H05K1/14H05K3/341H05K3/36H05K2201/10
Inventor 小出士朗土桥大亮樱井洋平
Owner DENSO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com