33results about "PCB attached/integrated components" patented technology

A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

An electronic package is provided, which includes: an insulating layer; an electronic element embedded in the insulating layer and having a sensing area exposed from the insulating layer; and a circuit layer formed on the insulating layer and electrically connected to the electronic element, thereby reducing the thickness of the overall package structure.

A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming up plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

The invention relates to a three-dimensional integrated wafer-level package structure and a package method for a high-frequency IPD (Integrated Passive Device) module. The three-dimensional integrated wafer-level package structure comprises an PCB (Printed Circuit Board) system board and is characterized in that a low-frequency IPD package body is piled on the PCB system board, and a radio-frequency IPD package body is piled on the low-frequency IPD package body; the PCB system board is connected with the front surface of the low-frequency IPD package body through a solder ball; the low-frequency IPD package body is electrically connected with the outside through a solder ball; the low-frequency IPD package body is connected with the radio-frequency IPD package body through a first metal soldering pad and a second metal soldering pad. According to the package structure and the package method, the functions of the radio-frequency IPD module are partitioned, and an IPD chip is partitioned into two parts including a lower-frequency circuit and a radio-frequency circuit; the packaging of the radio-frequency IPD module with a three-dimensional structure is realized by adopting wafer-level planar machining and TSV (Through Silicon Via) three-dimensional integrated wafer technologies based on a high-resistance silicon material, and the interference of the radio-frequency IPD module on a signal circuit on the PCB system board is reduced. In the meantime, the area of occupying the PCB system board is correspondingly reduced, and device and system minimization is facilitated.

A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.

In a method for integrating a component (3) into a printed circuit board, the following steps are provided:providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10),arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, andconnecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board.Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.

The invention discloses a vacuum fixed installation system for an integrated circuit. The vacuum fixed installation system comprises a fixing module, an adsorption module, a positioning module, a silicon wafer and a PCB. By arranging the fixing module, not only can the PCB be fixed on the upper surface of the heating table, but also the PCB can be heated, so that mutual pressing of the PCB is replaced, the phenomenon that an operator is scalded is avoided, the adsorption module is arranged to replace a clamp in an adsorption manner, and the problem that the clamp is easy to scratch the surfaceof the silicon wafer in the process of clamping the silicon wafer is solved.

Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

The invention provides a chip pin expansion device which comprises an expansion board, a plurality of regularly arranged pins are arranged on the expansion board, the expansion board is welded to theedge of a main chip, and the number of the pins of the main chip is increased. According to the invention, the I / O quantity can be expanded in BGA packaging of the same size. By changing the structureof the chip and increasing the number of the pins, the function requirement is met, meanwhile, the occupied space of a PCB can be saved, the PCB design time is shortened, and the chip is suitable forapplication and popularization.

A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.

An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

Disclosed is an embedded electronic component which can improve reliability of connection with external wiring and efficiency of an embedding process by including: a contact pad provided on at least one surface of a body portion and made of a conductive material; a first insulating layer for covering the at least one surface of the body portion; a first pad in contact with a surface of the contact pad and made of a conductive material; a rearrangement portion provided on a surface of the first insulating layer to be in contact with the first pad; a second pad provided on the surface of the first insulating layer to be in contact with the rearrangement portion; and a second insulating layer having an opening to expose a portion of the second pad while covering the first insulating layer, the first pad, the rearrangement portion, and the second pad.

An electronic package is provided, which includes: an insulating layer; an electronic element embedded in the insulating layer and having a sensing area exposed from the insulating layer; and a circuit layer formed on the insulating layer and electrically connected to the electronic element, thereby reducing the thickness of the overall package structure.

A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.

The invention relates to a bonding head, a bonding device, and a forming method of a cooling channel. The bonding head comprises a tool bit assembly and an adjusting assembly, the tool bit assembly comprises a pressing head and a heating block, the pressing head is connected to the heating block, and the pressing head is used for hot-pressing a conducting medium to a circuit board; and the adjusting assembly is connected to the end, away from the pressing head, of the heating block and comprises a balance block and an air pipe connector, the air pipe connector is connected to the surface of the balance block, a cooling loop is arranged in the balance block and provided with an air inlet and an air outlet which are communicated, and at least one of the air inlet and the air outlet is communicated with the air pipe connector. The cooling loop is arranged in the balance block, and cold air entering from the air pipe joint can be used for cooling the balance block, so that the pressure head is cooled, the pressure head is prevented from being deformed in a high-temperature state, and the flatness requirement and the stability process requirement of the pressing surface of the pressure head are ensured.

This electronic circuit comprises: a first printed wiring board (9); second printed wiring boards (10, 30, 50); and third printed wiring boards (20, 40, 60). The second printed wiring boards are mounted so that one edge (10A, 30A, 50A) thereof abuts a part mounting surface (9A) of the first printed wiring board, i.e. abuts a surface of the first printed wiring board on which parts (3, 5, 7) are mounted. The third printed wiring boards are mounted so that one edge (20A, 40A, 60A) thereof abuts the part mounting surface. The second printed wiring boards and the third printed wiring boards are connected to each other in a state in which the board thickness direction of the second printed wiring boards is oriented in a different direction, around a normal line rising from the part mounting surface, from that of the third printed wiring boards. Further, an antenna pattern is formed on the second printed wiring boards and / or the third printed wiring boards.

Mounting device (10) for semiconductor packages (11), the device (10) comprising a bottom side (14) comprising one or more cavities (15) to house semiconductor packages (11); a top side (13) comprising a plurality of holes (13a) extending from the bottom side (14) to the top side (13) for accommodating contact pins (12) of the semiconductor package (11); and fixation means to fix the device (10) housing the semiconductor packages (11) to a heat dissipation structure.

The embodiment of the invention discloses a welding method. The method comprises the steps that a to-be-welded element is fixed to one side of a PCBA board; a connecting line is wound on a protruding part, the line end part of the connecting line is snapped through the edge of the protruding part, and a connecting piece is formed; the connecting piece is inverted, and the part, wound with the connecting wire, of the protruding part is immersed in the tin liquid; and the PCBA board is moved, so that the wire skin of the connecting wire is separated, and the welding of the inner core of the connecting wire and the tinned part on the protruding part is realized. Compared with an existing scheme, the scheme does not need manual patent leather breaking and thread end cutting, the working procedures are saved, workers do not need high-requirement training and the method is easy to master; the welding area is large, the contact resistance is small, and the product performance is more stable; and the welding strength is high, falling is not prone to occurring, and the reject ratio is reduced.

The invention relates to a method for preparing a sealed surface-mounted EMI filter and welding tooling thereof, wherein the welding tooling used for preparing a sealed surface-mounted EMI filter includes: a bottom pallet, a middle pallet and a top pallet; There is a groove for placing the substrate. The middle pallet can be detachably connected with the bottom pallet. The middle pallet is provided with a through hole matching the frame. When the middle pallet is connected with the bottom pallet, the through hole and the groove Correspondingly, the top supporting plate is detachably connected with the bottom supporting plate, and the top supporting plate is used for compressing and fixing the surrounding frame. The EMI filter is made by welding tooling, which can ensure that the frame is placed exactly in the middle of the corresponding pad on the substrate during welding, avoiding horizontal or inclined offsets that affect the quality and appearance of the weld; at the same time, through the top support The plate exerts pressure on the frame and presses the frame and the LTCC substrate tightly, which is conducive to the removal of gas inside the weld during welding, ensuring that the weld is dense and free of pores, and meets the airtightness requirements of the finished product.

The invention relates to a preparation method of a sealed surface-mounted EMI filter and a welding tool thereof. The welding tool for preparing the sealed surface-mounted EMI filter comprises a bottomlayer supporting plate, a middle layer supporting plate and a top layer supporting plate, wherein a groove for accommodating a substrate is formed in the bottom layer supporting plate, the middle layer supporting plate is detachably connected with the bottom layer supporting plate, a through hole matched with the enclosure frame is formed in the middle layer supporting plate , when the middle layer supporting plate is connected with the bottom layer supporting plate, the through hole corresponds to the groove, the top layer supporting plate is detachably connected with the bottom layer supporting plate, and the top layer supporting plate is used for pressing and fixing the enclosure frame. The EMI filter is manufactured by means of the welding tool, thereby guaranteeing that the enclosureframe is just placed in the middle of a corresponding bonding pad on the substrate in the welding process, and avoiding the situation that the quality and attractiveness of a weld joint are affecteddue to horizontal deviation or inclined deviation; meanwhile, pressure is applied to the enclosure frame through using the top layer supporting plate, and the enclosure frame and the LTCC substrate are pressed tightly, thereby being conductive to exhausting gas in a weld joint during welding, guaranteeing that the weld joint is dense and free of pores and satisfying the air tightness requirement of a finished product.