33results about "PCB attached/integrated components" patented technology

An electronic encapsulation structure comprises an insulating layer, an electronic component which is embedded in the insulating layer and has an induction area exposed to the insulator, and a first circuit layer which is arranged on the insulating layer and electrically connected with the electronic component. Thus, the thickness of the whole encapsulation structure is reduced.

A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.

An objective of the present invention is to provide a printed board being capable of suppressing EMI emissions from power supply wirings. To accomplish the objective, a printed board of the present invention includes a plurality of ground layers disposed in a printed board, a power supply layer put between the plurality of the ground layers, and through holes disposed along at least periphery of the printed board and connecting the plurality of the ground layers, wherein the through holes are disposed at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.Further, a printed board of the present invention includes a power supply layer disposed in a printed board and put between ground layers above and below the power supply layers, and a plurality of through holes connecting the ground layers above and below the power supply layers, wherein the plurality of the through holes are disposed at and near the power supply layer and are spaced apart at intervals according to a wavelength corresponding to a maximum frequency of electromagnetic waves to be suppressed.

Disclosed is an embedded electronic component which can improve reliability of connection with external wiring and efficiency of an embedding process by including: a contact pad provided on at least one surface of a body portion and made of a conductive material; a first insulating layer for covering the at least one surface of the body portion; a first pad in contact with a surface of the contact pad and made of a conductive material; a rearrangement portion provided on a surface of the first insulating layer to be in contact with the first pad; a second pad provided on the surface of the first insulating layer to be in contact with the rearrangement portion; and a second insulating layer having an opening to expose a portion of the second pad while covering the first insulating layer, the first pad, the rearrangement portion, and the second pad.

An electronic package is provided, which includes: an insulating layer; an electronic element embedded in the insulating layer and having a sensing area exposed from the insulating layer; and a circuit layer formed on the insulating layer and electrically connected to the electronic element, thereby reducing the thickness of the overall package structure.

A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.

Power supply unit, in particular for a sterilization device, comprising at least one electric component, wherein, at least one of the electric components is at least partly covered with a solid insulation layer, wherein the solid insulation layer is adapted to provide an electric insulation.

A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

The invention relates to a method for preparing a sealed surface-mounted EMI filter and welding tooling thereof, wherein the welding tooling used for preparing a sealed surface-mounted EMI filter includes: a bottom pallet, a middle pallet and a top pallet; There is a groove for placing the substrate. The middle pallet can be detachably connected with the bottom pallet. The middle pallet is provided with a through hole matching the frame. When the middle pallet is connected with the bottom pallet, the through hole and the groove Correspondingly, the top supporting plate is detachably connected with the bottom supporting plate, and the top supporting plate is used for compressing and fixing the surrounding frame. The EMI filter is made by welding tooling, which can ensure that the frame is placed exactly in the middle of the corresponding pad on the substrate during welding, avoiding horizontal or inclined offsets that affect the quality and appearance of the weld; at the same time, through the top support The plate exerts pressure on the frame and presses the frame and the LTCC substrate tightly, which is conducive to the removal of gas inside the weld during welding, ensuring that the weld is dense and free of pores, and meets the airtightness requirements of the finished product.

The invention relates to a preparation method of a sealed surface-mounted EMI filter and a welding tool thereof. The welding tool for preparing the sealed surface-mounted EMI filter comprises a bottomlayer supporting plate, a middle layer supporting plate and a top layer supporting plate, wherein a groove for accommodating a substrate is formed in the bottom layer supporting plate, the middle layer supporting plate is detachably connected with the bottom layer supporting plate, a through hole matched with the enclosure frame is formed in the middle layer supporting plate , when the middle layer supporting plate is connected with the bottom layer supporting plate, the through hole corresponds to the groove, the top layer supporting plate is detachably connected with the bottom layer supporting plate, and the top layer supporting plate is used for pressing and fixing the enclosure frame. The EMI filter is manufactured by means of the welding tool, thereby guaranteeing that the enclosureframe is just placed in the middle of a corresponding bonding pad on the substrate in the welding process, and avoiding the situation that the quality and attractiveness of a weld joint are affecteddue to horizontal deviation or inclined deviation; meanwhile, pressure is applied to the enclosure frame through using the top layer supporting plate, and the enclosure frame and the LTCC substrate are pressed tightly, thereby being conductive to exhausting gas in a weld joint during welding, guaranteeing that the weld joint is dense and free of pores and satisfying the air tightness requirement of a finished product.

A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.