Three-dimensional integrated wafer-level package structure and package method for high-frequency IPD (Integrated Passive Device) module

Abstract

The invention relates to a three-dimensional integrated wafer-level package structure and a package method for a high-frequency IPD (Integrated Passive Device) module. The three-dimensional integrated wafer-level package structure comprises an PCB (Printed Circuit Board) system board and is characterized in that a low-frequency IPD package body is piled on the PCB system board, and a radio-frequency IPD package body is piled on the low-frequency IPD package body; the PCB system board is connected with the front surface of the low-frequency IPD package body through a solder ball; the low-frequency IPD package body is electrically connected with the outside through a solder ball; the low-frequency IPD package body is connected with the radio-frequency IPD package body through a first metal soldering pad and a second metal soldering pad. According to the package structure and the package method, the functions of the radio-frequency IPD module are partitioned, and an IPD chip is partitioned into two parts including a lower-frequency circuit and a radio-frequency circuit; the packaging of the radio-frequency IPD module with a three-dimensional structure is realized by adopting wafer-level planar machining and TSV (Through Silicon Via) three-dimensional integrated wafer technologies based on a high-resistance silicon material, and the interference of the radio-frequency IPD module on a signal circuit on the PCB system board is reduced. In the meantime, the area of occupying the PCB system board is correspondingly reduced, and device and system minimization is facilitated.

Description

technical field [0001] The invention relates to a three-dimensional integrated wafer-level packaging structure and packaging method of a high-frequency IPD module, belonging to the technical field of IPD devices. Background technique [0002] After nearly ten years of development, IPD (Integrated Passive Devices) is gaining more and more recognition in the market. The power to promote the development of IPD mainly comes from mobile communication products. Taking the commonly used dual-band mobile phone as an example, there are about 100~300 components in the whole machine, and passive components account for 95% of the mobile phone components, and the overall 70% of the PCB area; in view of this, manufacturers' demand for IPD (Integrated Passive Devices) will continue to grow, because the use of integrated solutions is still one of the few ways to continue to reduce size and increase functionality. In the past few years, most IPD components were mainly concentrated in baseba...

AI Technical Summary

Problems solved by technology

[0003] However, the radiation generated by traditional RF IPD devices is more likely to be coupled to the signal path of the PCB system board, generating radio frequency noise, which interferes with the circuit on the PCB system board, and affects the audio and video call quality of the mobile phone.

[0004] An effective way to solve the problem of signal interference between the RF IPD chip and the PCB system board is to set the ground wire to surround the signal line (referred to as ground wrap) in the PCB system board. However, the ground wrap will increase the amount of wiring and make the originally limited The PCB routing area becomes more crowded, the manufacturing process is complicated, and the cost

In addition, the ground wire will also increase the distributed capacitance of the signal, increase the impedance of the transmission line, and slow down the signal edge; the parasitic electrical effect generated by the ground wire is also the main negative impact of the scheme

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