A kind of preparation method of sealed surface mount emi filter and its welding tool

A technology of welding tooling and filters, which is applied to printed circuits connected with non-printed electrical components, printed circuit manufacturing, and printed circuits assembled with electrical components. Aerospace requirements and other issues

Active Publication Date: 2021-11-19
北京航天微电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing technology, it is difficult to control the sealing performance of the product during packaging, and if the sealing performance is insufficient, it cannot meet the aerospace requirements. Therefore, how to ensure that the sealing performance of the product packaging meets the aerospace requirements

Method used

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  • A kind of preparation method of sealed surface mount emi filter and its welding tool
  • A kind of preparation method of sealed surface mount emi filter and its welding tool
  • A kind of preparation method of sealed surface mount emi filter and its welding tool

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Embodiment Construction

[0031] The principles and features of the present application are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present application, and are not intended to limit the scope of the present application.

[0032] In the description of this specification, it should be understood that the terms "center", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "inner", "outer", "circumferential", "circumferential" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this The description and simplified description do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the description.

[0033] In the descript...

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Abstract

The invention relates to a method for preparing a sealed surface-mounted EMI filter and welding tooling thereof, wherein the welding tooling used for preparing a sealed surface-mounted EMI filter includes: a bottom pallet, a middle pallet and a top pallet; There is a groove for placing the substrate. The middle pallet can be detachably connected with the bottom pallet. The middle pallet is provided with a through hole matching the frame. When the middle pallet is connected with the bottom pallet, the through hole and the groove Correspondingly, the top supporting plate is detachably connected with the bottom supporting plate, and the top supporting plate is used for compressing and fixing the surrounding frame. The EMI filter is made by welding tooling, which can ensure that the frame is placed exactly in the middle of the corresponding pad on the substrate during welding, avoiding horizontal or inclined offsets that affect the quality and appearance of the weld; at the same time, through the top support The plate exerts pressure on the frame and presses the frame and the LTCC substrate tightly, which is conducive to the removal of gas inside the weld during welding, ensuring that the weld is dense and free of pores, and meets the airtightness requirements of the finished product.

Description

technical field [0001] The invention belongs to the field of filter manufacturing, and in particular relates to a method for preparing a sealed surface-mounted EMI filter and welding tooling thereof. Background technique [0002] With the development of switching power converters in the direction of miniaturization, high frequency and high power density, the market has very urgent requirements for the miniaturization of EMI filters (electromagnetic interference filters). [0003] Among them, the use of LTCC substrate (Low Temperature Co-fired Ceramic) integrated packaging technology to design surface-mount EMI filters is one of the development directions for product miniaturization. [0004] The LTCC integrated package surface-mount EMI filter is composed of LTCC substrate, frame, cover plate, capacitor, choke coil, etc. In the prior art, the LTCC substrate uses conductive paste to print PdAg pads on green ceramic tape and then co- Then the welding of the surrounding frame,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/181H05K3/341H05K2201/10H05K2203/04
Inventor 孙江超卢鹏程张昊冀兴军
Owner 北京航天微电科技有限公司
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