Electronic encapsulation structure

Abstract

An electronic encapsulation structure comprises an insulating layer, an electronic component which is embedded in the insulating layer and has an induction area exposed to the insulator, and a first circuit layer which is arranged on the insulating layer and electrically connected with the electronic component. Thus, the thickness of the whole encapsulation structure is reduced.

Description

technical field [0001] The invention relates to an electronic packaging structure, in particular to an electronic packaging structure that can be thinned. Background technique [0002] With the development of the electronic industry, today's electronic products have tended to be designed in the direction of thinner, smaller and more functional, and semiconductor packaging technology has also developed different packaging types. [0003] At present, most electronic components used in sensor components or camera lenses are still packaged by wire bonding or Chip On Board (COB for short). [0004] Such as Figure 1A As shown, the existing wire bonding package structure 1 includes: a substrate 10 , an electronic component 13 and a packaging compound 18 . [0005] The substrate 10 is provided with a first circuit layer 11 and a second circuit layer 12 on the upper and lower sides, and the first and second circuit layers are electrically connected through through holes or blind ho...

AI Technical Summary

Problems solved by technology

[0018] However, in the existing photosensitive packaging structure 1", due to the high cost of making the conductive TSV 100, the difficulty of integration, and the high technical difficulty, especially the electronic components used in sensor components or camera lenses are all expensive.

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