Composite heat-insulating wallboard and preparation method thereof

A composite thermal insulation and wallboard technology, applied in the field of thermal insulation wallboards, can solve the problems of interface defects, poor compatibility between organic EPS aggregates and inorganic cementitious materials, and unsatisfactory physical and mechanical properties of wallboards. The effect of optimizing gradation, improving interfacial compatibility, and improving physical and mechanical properties

Inactive Publication Date: 2012-06-20
XIAMEN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal insulation core material of this type of composite thermal insulation wallboard still has the problems of interface defects caused by poor compatibility between organic EPS aggregate and inorganic cementitious material, physical and mechanical properties and unsatisfactory integrity of the wallboard.

Method used

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  • Composite heat-insulating wallboard and preparation method thereof
  • Composite heat-insulating wallboard and preparation method thereof
  • Composite heat-insulating wallboard and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1) Weigh 100 parts of 42.5 ordinary Portland cement, 10 parts of class II fly ash, 5 parts of gypsum, 0.5 parts of latex powder, 0.8 parts of naphthalene superplasticizer, and 0.1 part of anhydrous calcium chloride and add them to the mortar mixer In the process, first dry mix evenly, then add water to the mortar mixer at a water-cement ratio of 0.5, and continue stirring.

[0030] 2) Weigh 0.1 part of Maleamic Acid-Isobutyl POSS (manufactured by American hybrid plastics company), 1.5 parts of EPS (3:1 for particle size 4mm and 2mm), and dissolve Maleamic Acid-Isobutyl POSS in n-hexane at a ratio of 1:10 In the process, the dissolved solution is sprayed on the EPS, and the EPS whose surface is wetted by the POSS solution is added to the mixer for continuous stirring.

[0031] 3) Add 0.2 parts of wd-11 cement foaming agent into the foaming machine and foam for 4-5 minutes to obtain a large amount of foam into the mixer and stir evenly to obtain the insulation core materi...

Embodiment 2～6

[0037] The preparation method is the same as in Example 1, and the dosage of each component is changed as shown in Table 2. The physical performance test results of the light-weight, energy-saving and heat-preserving composite wallboard obtained are the same as in Example 1.

[0038] Table 2 The amount of each component in each embodiment (mass parts)

[0039]

[0040] figure 1 A schematic diagram of the structural composition of the lightweight composite thermal insulation wallboard of the present invention is given, in figure 1 In the middle, the upper and lower panels 1 are made of calcium silicate board, and the insulation core material 2 sandwiched between the upper and lower panels 1 is composed of EPS as aggregate 3 and aerated concrete (including various additives) 4 , EPS surface coated with Maleamic Acid-Isobuty POSS layer 5.

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Abstract

The invention discloses a composite heat-insulating wallboard and a preparation method thereof and relates to a heat-insulating wallboard. The heat-insulating wallboard is provided with two layers of calcium silicate plates, wherein a heat-insulating core material is clamped between the two layers of calcium silicate plates and is prepared from cement, coal ash, gypsum, expandable polystyrene (EPS), Maleamic Acid-Isobutyl Polyhedral Oligomeric Silsesquioxane (POSS), emulsion powder, a water reducing agent, a foaming agent and an early strength agent. Dry POSS powder is dissolved in normal hexane and then the solution is sprayed onto the surface of EPS particles to obtain substance A; the cement, the coal ash, the gypsum and the emulsion powder are drily stirred, water is added into the mixture, the mixture is stirred into paste, the substance A is added into the paste to form a slurry B; the foaming agent solution is stirred through a stirrer to form foam C; the slurry B and the foam C are mixed to obtain a heat-insulating core material slurry; the surfaces of the calcium silicate plates are brushed and washed, the calcium silicate plates are placed on the two sides of a fixed mold, the heat-insulating core material slurry is poured into the middle of the two calcium silicate plates, and the mold is vibrated to mold the slurry; and the mold is de-molded, and after watering to maintain, the wallboard is obtained.

Description

technical field [0001] The invention relates to a thermal insulation wallboard, in particular to a lightweight composite thermal insulation wallboard based on an organic / inorganic hybrid material interface modification technology. Background technique [0002] With the development of urban modernization, reducing building energy consumption, improving energy utilization efficiency, and promoting the development of building energy conservation have received more and more attention from the government and all walks of life. The use of lightweight thermal insulation materials in buildings can save energy by 50% to 80%. Therefore, the development of energy-saving building materials has become one of the effective ways to save energy in buildings. Early composite thermal insulation wallboards were made of polystyrene boards or extruded boards sandwiched between two layers of cement sheets. After this wallboard is used for a period of time, due to the poor compatibility between t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04C2/288C04B38/02C04B28/14B28B1/087B28B1/50
CPCY02A30/244
Inventor 戴李宗张龙陈建良陈光剑陈珉张菁菁许一婷曾碧榕
Owner XIAMEN UNIV
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