Bonding head, bonding device, and forming method of cooling channel

Abstract

The invention relates to a bonding head, a bonding device, and a forming method of a cooling channel. The bonding head comprises a tool bit assembly and an adjusting assembly, the tool bit assembly comprises a pressing head and a heating block, the pressing head is connected to the heating block, and the pressing head is used for hot-pressing a conducting medium to a circuit board; and the adjusting assembly is connected to the end, away from the pressing head, of the heating block and comprises a balance block and an air pipe connector, the air pipe connector is connected to the surface of the balance block, a cooling loop is arranged in the balance block and provided with an air inlet and an air outlet which are communicated, and at least one of the air inlet and the air outlet is communicated with the air pipe connector. The cooling loop is arranged in the balance block, and cold air entering from the air pipe joint can be used for cooling the balance block, so that the pressure head is cooled, the pressure head is prevented from being deformed in a high-temperature state, and the flatness requirement and the stability process requirement of the pressing surface of the pressure head are ensured.

Description

technical field [0001] The invention relates to the technical field of display panels, in particular to a bonding head, a bonding device and a method for forming a cooling channel. Background technique [0002] The bonding process is to fix flexible materials such as COF (Chip On Flex) with ACF (Anisotropic Conductive Film) glue on specific terminals of glass or circuit boards, and use a high-temperature pressure head to apply a certain Pressure, and keep the pressure for a period of time, so that the conductive particles in the ACF are broken, so as to achieve the purpose of smooth signal between COF and the terminal. With the continuous development of various large-size display screens, the demand for large-size bonding equipment continues to emerge. Large-size bonding equipment can meet the bonding requirements of most larger-sized products in terms of size, but the increase in the size of the indenter also brings some problems. The size of the indenter increases, and t...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a bonding head for the technical problems that the deformation of the large-sized indenter under high temperature conditions is enlarged, resulting in the flatness of the pressing head's flatness is not stable enough, and the bonding process cannot meet the process requirements.

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