Preparation method of sealed surface-mounted EMI filter and welding tool thereof

A technology of welding tooling and filters, which is applied to printed circuits connected with non-printed electrical components, printed circuit manufacturing, and printed circuits assembled with electrical components. Insufficient performance and other problems, to achieve the effect of ensuring compactness without pores, high yield rate, and low production cost

Active Publication Date: 2021-03-02
北京航天微电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing technology, it is difficult to control the sealing performance of the product during packaging, and if the sealing performance is insufficient, it cannot meet the aerospace requirements. Therefore, how to ensure that the sealing performance of the product packaging meets the aerospace requirements

Method used

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  • Preparation method of sealed surface-mounted EMI filter and welding tool thereof
  • Preparation method of sealed surface-mounted EMI filter and welding tool thereof
  • Preparation method of sealed surface-mounted EMI filter and welding tool thereof

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Embodiment Construction

[0031]The principles and features of the present application are described below in conjunction with the accompanying drawings. The examples cited are only used to explain the present application, and are not used to limit the scope of the present application.

[0032]In the description of this specification, it should be understood that the terms "center", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "inner", "outer", "circumferential", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description The specification and simplified description do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the specification.

[0033]In the description of thi...

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Abstract

The invention relates to a preparation method of a sealed surface-mounted EMI filter and a welding tool thereof. The welding tool for preparing the sealed surface-mounted EMI filter comprises a bottomlayer supporting plate, a middle layer supporting plate and a top layer supporting plate, wherein a groove for accommodating a substrate is formed in the bottom layer supporting plate, the middle layer supporting plate is detachably connected with the bottom layer supporting plate, a through hole matched with the enclosure frame is formed in the middle layer supporting plate , when the middle layer supporting plate is connected with the bottom layer supporting plate, the through hole corresponds to the groove, the top layer supporting plate is detachably connected with the bottom layer supporting plate, and the top layer supporting plate is used for pressing and fixing the enclosure frame. The EMI filter is manufactured by means of the welding tool, thereby guaranteeing that the enclosureframe is just placed in the middle of a corresponding bonding pad on the substrate in the welding process, and avoiding the situation that the quality and attractiveness of a weld joint are affecteddue to horizontal deviation or inclined deviation; meanwhile, pressure is applied to the enclosure frame through using the top layer supporting plate, and the enclosure frame and the LTCC substrate are pressed tightly, thereby being conductive to exhausting gas in a weld joint during welding, guaranteeing that the weld joint is dense and free of pores and satisfying the air tightness requirement of a finished product.

Description

Technical field[0001]The invention belongs to the field of filter manufacturing, and specifically relates to a method for preparing a sealed surface-mounted EMI filter and a welding tool.Background technique[0002]With the development of switching power converters in the direction of miniaturization, high frequency, and high power density, the market has very urgent requirements for miniaturization of EMI filters (electromagnetic interference filters).[0003]Among them, the use of LTCC substrate (Low Temperature Co-fired Ceramic) integrated packaging technology to design surface mount EMI filters is one of the development directions of product miniaturization.[0004]The LTCC integrated package surface mount EMI filter is composed of an LTCC substrate, a frame, a cover plate, a capacitor, a choke coil, etc. In the prior art, the LTCC substrate uses a conductive paste to be printed on the green ceramic tape to make PdAg pads and then share them. After firing, the welding of the enclosure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K1/181H05K3/341H05K2201/10H05K2203/04
Inventor 孙江超卢鹏程张昊冀兴军
Owner 北京航天微电科技有限公司
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