Chip pin expansion device

Abstract

The invention provides a chip pin expansion device which comprises an expansion board, a plurality of regularly arranged pins are arranged on the expansion board, the expansion board is welded to theedge of a main chip, and the number of the pins of the main chip is increased. According to the invention, the I / O quantity can be expanded in BGA packaging of the same size. By changing the structureof the chip and increasing the number of the pins, the function requirement is met, meanwhile, the occupied space of a PCB can be saved, the PCB design time is shortened, and the chip is suitable forapplication and popularization.

Description

technical field [0001] The invention belongs to the technical field of PCB, in particular to a chip pin expansion device. Background technique [0002] With the advancement of technology, the integration level of chips continues to increase, and the I / O pins increase sharply. In order to meet the needs of development, BGA packaging has begun to be widely used. BGA (Ball Grid Array) is a relatively common packaging form for chips at present, and BGA is a high-density surface mount packaging technology. On the bottom of the package, the pins are ball-shaped and arranged in a grid-like pattern, hence the name BGA. [0003] The number of I / Os of existing BGA packaged devices is mainly determined by the size of the package and the pitch of solder balls. Since the solder balls of the BGA package are arranged in an array under the package substrate, the number of I / Os of the device can be greatly increased, the package size can be reduced, and the assembly space can be saved. Th...

AI Technical Summary

Problems solved by technology

First, for the chip, the chip resources are not fully utilized, and the remaining I / O pins are idle

Second, for high-density PCB boards, the assembly space increases; thirdly, for high-density PCBs that have already been designed, the time for chip replacement and redesign of PCBs is lengthened

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