Vacuum fixed installation system for integrated circuit

A technology for mounting systems and integrated circuits, applied in printed circuits, printed circuit manufacturing, printed circuit assembly of electrical components, etc., can solve problems such as increasing assembly errors, and achieve the effect of avoiding burns

Inactive Publication Date: 2020-11-20
隋心怡
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the deficiencies of the prior art, the present invention provides a vacuum fixed installation system for integrated circuits, which s

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  • Vacuum fixed installation system for integrated circuit
  • Vacuum fixed installation system for integrated circuit
  • Vacuum fixed installation system for integrated circuit

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, the present invention provides a technical solution: a vacuum fixed installation system for integrated circuits, including a fixed module 1, an adsorption module 2, a positioning module 3, a silicon wafer 4 and a PCB board 5, such as figure 1 , figure 2 and Figure 5 , wherein the fixed module 1 includes a heating table 101, a heating table support 102...

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Abstract

The invention discloses a vacuum fixed installation system for an integrated circuit. The vacuum fixed installation system comprises a fixing module, an adsorption module, a positioning module, a silicon wafer and a PCB. By arranging the fixing module, not only can the PCB be fixed on the upper surface of the heating table, but also the PCB can be heated, so that mutual pressing of the PCB is replaced, the phenomenon that an operator is scalded is avoided, the adsorption module is arranged to replace a clamp in an adsorption manner, and the problem that the clamp is easy to scratch the surfaceof the silicon wafer in the process of clamping the silicon wafer is solved.

Description

technical field [0001] The invention relates to the technical field of product production, in particular to a vacuum fixed installation system for integrated circuits. Background technique [0002] After the transistor was invented and mass-produced, various solid-state semiconductor components such as diodes and transistors were widely used, replacing the function and role of vacuum tubes in circuits. In the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of tiny transistors into a small chip, which is a huge improvement. The scale production capability of integrated circuits, reliability, and modular approach to circuit design ensure the rapid adoption of standardized integrated circuits instead of designing discrete transistors, but the integrated circuits of transis...

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3431H05K2201/10H05K2203/085
Inventor 隋心怡
Owner 隋心怡
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